Planar Connection Board Layout for Low-Inductance Power Modules
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Solution Overview
Problem
Power apparatuses experience energy loss and component damage due to voltage spikes caused by stray inductance in current paths, affecting operating efficiency and reliability.
Innovation Solution
A power apparatus design featuring a substrate with separated areas and a connection board that electrically connects power components, reducing current path length and stray inductance by using a flat-shaped connection board instead of wire bonding, which provides mechanical strength and minimizes energy consumption and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect power components on separated substrate areas, then electrical connection is achieved, but current path length increases causing increased stray inductance and voltage spikes
Solution Approach 1:
The connection board transitions the connection from a three-dimensional wire bonding approach to a two-dimensional planar structure. By flattening the connection path onto the connection board surface, the current path is significantly shortened while maintaining electrical connectivity between separated substrate areas, thereby reducing stray inductance and voltage spikes.
Solution Approach 2:
The connection board serves as an intermediary component between the first and second substrate areas. It provides a dedicated low-inductance path for current flow, mediating the electrical connection between power components on separated areas while minimizing the harmful effects of long current paths through its optimized planar geometry.
2Ease of manufacture
If long current paths are used to connect power components, then electrical connection is achieved, but stray inductance increases causing energy loss and voltage spikes
Solution Approach 1:
By converting the connection structure from a multi-dimensional wire bonding approach to a planar two-dimensional connection board, the current path is optimized to be as short as possible. This dimensional simplification reduces the loop area and stray inductance, thereby minimizing energy loss during switching operations while maintaining ease of manufacturing through standardized PCB-like fabrication processes.
3Power
If switches are used for power conversion, then power conversion function is achieved, but voltage spikes occur during switching causing component damage
Solution Approach 1:
The connection board design accepts the inevitable voltage spikes that occur during switch operation but converts the harmful effect by providing a low-inductance current path. The planar structure minimizes the loop area, thereby reducing the magnitude of voltage spikes generated during switching transitions and preventing component damage while maintaining full power conversion capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces voltage spikes, energy loss, and device damage, enhancing operating efficiency and reliability by shortening current paths and offsetting electromagnetic interference.
Implementation Method 1
The first transmission layer is electrically connected to the first power component and the second area respectively
Implementation Method 2
The second current path is parallel to and opposite to the first current path
Data Source
AI summary
A power apparatus (1, 2) includes a substrate (10, 10′), a first power component (20), a second power component (30), and a connection board (40, 40′). The substrate (10, 10′) includes a first area (11) and a second area (12) separated from each other. The first power component (20) is arranged on the first area (11). The second power component (30) is arranged on the second area (12). The connection board (40, 40′) is arranged between the first area (11) and the second area (12), and is electrically connected to the first power component (20) and the second area (12) respectively.