Segmented Cooling for Power Converter Switches and Inductors
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Solution Overview
Problem
Power converters generate significant heat during switching operations, which can lead to failure if not properly managed, especially as switching frequency increases, and existing cooling systems often struggle to efficiently handle the heat dissipation of both power switches and inductors/capacitors.
Innovation Solution
A dual cooling system is implemented for power converters, with a first cooling system managing heat dissipation from power switches and a second system addressing the heat generated by inductors/capacitors, where the switching frequency is optimized to match the heat dissipation capacity of each system, and additional cooling features such as separate compartments, heat sinks, and liquid/air cooling systems are used to enhance heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If switching frequency of power switches is increased, then power conversion efficiency is improved and component size is reduced, but heat generation from power switches increases significantly
Solution Approach 1:
The cooling system is segmented into two independent subsystems: a first cooling system dedicated to power switches and a second cooling system dedicated to inductors and capacitors. This segmentation allows each cooling system to be optimized for its specific heat load, enabling the power switches to operate at higher frequencies for improved efficiency while the first cooling system handles the increased heat generation separately and effectively.
2Volume of moving object
If switching frequency is increased to reduce inductor and capacitor size, then component dimensions are reduced, but heat dissipation requirements become more stringent
Solution Approach 1:
The cooling requirements for inductors and capacitors are extracted from the power switch cooling system and handled by a separate second cooling system. This allows the power conversion circuit to operate at higher switching frequencies with reduced component sizes, while the second cooling system independently manages the heat dissipation from inductors and capacitors without being constrained by the power switch thermal limits.
3Device complexity
If a single cooling system is used for both power switches and inductors/capacitors, then device complexity is reduced, but cooling effectiveness for high-frequency operation is insufficient
Solution Approach 1:
Each cooling system is designed with local quality optimized for its specific target components. The first cooling system is configured with cooling elements positioned to maximize heat removal from power switches, while the second cooling system is configured specifically for inductors and capacitors. This localized optimization ensures high cooling effectiveness for each component type, enabling reliable high-frequency operation despite the increased overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces heat-related failures by optimizing switching frequency and utilizing advanced cooling systems, ensuring efficient heat dissipation and improved reliability of power converters.
Implementation Method 1
a heat sink for attaching to at least one of the switches to transfer heat generated by said at least one switch
Implementation Method 2
liquid cooling system
Implementation Method 3
phase change material cooling system
Data Source
AI summary
A power conversion apparatus with modified cooling properties has been disclosed. The apparatus comprises an AC port, at least one DC port, a chassis, at least one power conversion module mounted in said chassis connectable to off-board conductors and said AC and said at least one DC ports, a module heat sink attached to each one of said at least one power conversion module for cooling said module, wherein said off-board inductors are mounted in said chassis together and separate from modules with one or more of an inductor heat sink and cooling fluid circulator for cooling said inductors.