Power Module Heat Sink Assembly with Integrated Transfer Molding
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Solution Overview
Problem
The manufacturing time for power modules is prolonged due to the requirement of a curing step after the transfer molding and heat sink joining steps in existing methods.
Innovation Solution
A power module and manufacturing method where a subassembly including a first electrode, a semiconductor device, and a second electrode is joined to a heat sink via a joining material, with a thermoplastic resin injected to mold the resin portion integrally with the components, thereby eliminating the need for a separate curing step and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the transfer molding step and heat sink joining step are performed separately with curing steps after each, then the manufacturing process is simple and easy to implement, but the manufacturing time becomes longer
Solution Approach 1:
The patent merges the transfer molding step and heat sink joining step into a single integrated process. The molding die incorporates both the molding cavity and the heat sink positioning structure, allowing the resin injection and heat sink attachment to occur simultaneously during one curing cycle, thereby eliminating the need for separate curing steps and reducing overall manufacturing time
Solution Approach 2:
The molding die is designed with multi-functionality, serving both as the molding tool for injecting thermoplastic resin and as the heat sink assembly tool. The die structure includes features that simultaneously perform molding, heating, and heat sink joining functions, enabling one step to accomplish multiple objectives that traditionally required separate processing steps
2Manufacturing precision
If separate curing steps are performed after transfer molding and heat sink joining, then each step can be optimized independently, but the total manufacturing time increases
Solution Approach 1:
The patent combines multiple process optimizations into a single integrated curing step. The molding die structure enables simultaneous optimization of resin flow, heat distribution, and heat sink attachment conditions during one curing cycle, maintaining process precision while eliminating the time penalty of sequential operations
3Reliability
If the resin portion is molded after heat sink joining, then the joining material can be properly applied, but an additional curing step is required increasing manufacturing time
Solution Approach 1:
The patent performs preliminary positioning of the heat sink and application of joining material during the mold preparation phase before resin injection. The molding die is pre-configured with heat sink holders and joining material application structures, allowing the joining process to be initiated in advance and completed simultaneously with the resin curing process, thereby ensuring joining quality without adding extra time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens the manufacturing time for power modules, improves the heat radiating and insulating properties of the joining material, and enhances the reliability and stiffness of the power module without increasing equipment complexity or thickness.
Implementation Method 1
a thermoplastic resin is injected into an inner side of the molding die
Data Source
AI summary
A manufacturing method for a power module capable of shortening a manufacturing time for a power module is obtained. The manufacturing method for a power module includes: a subassembly arranging step of placing a subassembly including a first electrode, a semiconductor device, and a second electrode on a heat sink via a joining material; and a transfer molding step of, after the subassembly arranging step, under a state in which the first electrode, the semiconductor device, and a second-electrode inner portion are arranged in a region surrounded by the heat sink and a molding die, injecting a thermoplastic resin into the region, wherein, in the transfer molding step, the subassembly is joined to the heat sink via the joining material with use of the resin.