ECU Heat Conducting Component Positioning for Vibration Stability
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Solution Overview
Problem
In electronic control units, the heat conducting components are prone to positional deviation or falling off due to vibrations or external forces, leading to potential short-circuits and reduced heat dissipation efficiency, especially when the radiator comes into contact with the heat conducting component.
Innovation Solution
The electronic control unit is designed with a heat conducting component having a higher conductivity than a predetermined value, positioned at a specific distance from the heat generating component, and a radiator that is closer to the heat generating component than to the heat conducting component, ensuring stable positioning and effective heat dissipation while preventing short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the heat conducting component is positioned closer to the heat generating component to improve heat dissipation efficiency, then heat dissipation effectiveness is improved, but the risk of contact with the radiator increases causing positional deviation or short-circuits
Solution Approach 1:
The patent introduces a support structure as an intermediary element between the heat conducting component and the substrate. This support structure holds the heat conducting component at a predetermined position, preventing direct contact with the radiator while maintaining optimal distance for heat dissipation. The intermediary structure resolves the contradiction by providing mechanical support that stabilizes the heat conducting component's position without interfering with its thermal function.
2Temperature
If the heat conducting component is positioned closer to the radiator to reduce distance for heat conduction, then heat conduction efficiency is improved, but the component becomes vulnerable to vibrations and external forces causing contact and short-circuits
Solution Approach 1:
The patent implements a support structure that beforehand cushions and protects the heat conducting component from vibrations and external forces. The support structure is designed to absorb and distribute mechanical stresses before they can affect the heat conducting component, preventing contact with the radiator during vibrations while maintaining the component's optimal thermal conduction position.
3Loss of energy
If the heat conducting component is placed in an inner area of the radiator to maximize heat release, then heat release effectiveness is improved, but positional stability deteriorates due to proximity to the radiator
Solution Approach 1:
The patent segments the functional zones by positioning the heat conducting component in a dedicated area that is adjacent to but distinct from the radiator's inner heat release area. The support structure creates a spatial separation that maintains the heat conducting component's stability while preserving its proximity for effective heat transfer. This segmentation allows the radiator's inner area to focus on heat release while the heat conducting component maintains positional stability in its designated zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the heat conducting component's position, enhances heat dissipation from the heat generating component, and prevents short-circuits, ensuring reliable operation even under vibrations or external forces.
Implementation Method 1
a heat conducting component (40), formed of a material having a heat conductivity equal to or higher than a predetermined value, is provided on the one surface of the substrate (10) such that at least a part of the heat conducting component (40) is located in a range of a predetermined distance from the heat generating component (20)
Data Source
AI summary
An electronic control unit includes: a substrate (10); a heat generating component (20) provided on one surface (11) of the substrate and generates heat during operation; a heat conducting component (40) formed of a material having a heat conductivity equal to or higher than a predetermined value and provided on the one surface of the substrate such that at least a part of the heat conducting component is located in a range (R1) of a predetermined distance (L) from the heat generating component; a controller (60) provided on the substrate and controlling the operation of the heat generating component to control the object to be controlled; and a radiator (70) provided adjacent to the one surface of the substrate to radiate heat from the heat generating component and the heat conducting component. A distance (d1, d3) between the heat generating component and the radiator is equal to or shorter than a distance (d2, d4) between the heat conducting component and the radiator.


