Eddy Current Damping for Semiconductor Carrier Transport

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Solution Overview

Problem

Overhead hoist transport systems in semiconductor manufacturing facilities experience vibration and impact issues due to the pin/holder structure used for conveying wafers, which can damage the wafers during transfer.

Innovation Solution

A non-contact damping structure using an eddy current generated between a magnet member and a plate, connected through connecting members, is employed to suppress relative motion between the gripper and lifter, minimizing vibration and impact by controlling the damping force based on the apparatus's speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a pin/holder structure is used to connect the gripper and lifter, then the structural simplicity and ease of manufacture are improved, but vibration and impact occur during transfer causing wafer damage

Engineering Contradiction:

Improveease of manufactureVSAvoidvibration and impact

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical pin/holder connection system with a magnetic field-based connection system. The magnet member generates a magnetic field that attracts the ferromagnetic plate on the gripper, eliminating mechanical contact and thus preventing vibration and impact during carrier transfer while maintaining secure connection.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a magnetic field as an intermediary between the lifter and gripper. The magnet member on the lifter creates a magnetic field that acts on the ferromagnetic plate on the gripper, providing a non-contact force transmission medium that eliminates direct mechanical contact and associated vibrations.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a pin/holder structure is used to prevent carrier deviation, then the reliability of carrier positioning is improved, but the complexity of the device structure increases

Engineering Contradiction:

ImprovereliabilityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical positioning structures with a simplified magnetic field-based positioning system. The magnetic attraction force naturally centers the carrier on the gripper, eliminating the need for additional mechanical guides or adjustment mechanisms while maintaining reliable positioning.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Object-affected harmful factors

If a non-contact damping structure using eddy current is used, then vibration and impact are reduced, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvevibration and impactVSAvoidease of manufacture

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent replaces complex mechanical damping structures with a simpler magnetic field-based damping system. The magnetic attraction force provides natural damping by maintaining a consistent gap between the lifter and gripper, eliminating the need for additional mechanical dampers or complex suspension systems.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces vibration and impact transferred to the wafer, minimizes particle generation, and enhances shock absorption, allowing for faster and more precise transportation of wafers without the need for a pin/holder structure.

Implementation Method 1

Methodology Applied

Scientific EffectEddy current: Eddy Currents

Data Source

PatentUS11152240B2Apparatus for conveying carrier and system for controlling carrier having the same

Publication Date: 2021.10.19 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

Provided is an apparatus for conveying a carrier and a system for controlling a carrier having the same, which couples a hoist and a hand using a non-contact damping structure using an eddy current. The apparatus for conveying the carrier conveys a carrier containing a wafer, and includes: a gripper for gripping the carrier; and a lifter for raising and lowering the gripper, in which the gripper and the lifter are connected in a non-contact damping structure, and a relative motion thereof is suppressed.