Edge-Clamping Deposition Ring for Flat Thin Substrates

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Solution Overview

Problem

Thin semiconductor substrates tend to bow during processing in deposition chambers, leading to non-uniformity and requiring additional bonding and debonding steps with carrier plates, which increases processing time.

Innovation Solution

A process kit for deposition chambers that includes a deposition ring with a first and second portion, where the portions align to form a clamping surface, allowing mechanical clamping of the substrate's outer rim to flatten it, eliminating the need for bonded carriers and reducing processing time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If thin substrates are processed in deposition chambers, then substrate processing capability is improved, but substrate bowing occurs leading to process non-uniformity

Engineering Contradiction:

Improvesubstrate processing capabilityVSAvoidprocess uniformity

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The deposition ring is divided into two separate portions that can be positioned independently. The first portion engages the substrate at a first radial position while the second portion engages at a second radial position, allowing distributed support across the substrate surface to prevent bowing and maintain process uniformity

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If substrates are bonded to carrier plates to prevent bowing, then substrate flatness is improved, but processing time increases due to additional bonding and debonding steps

Engineering Contradiction:

Improvesubstrate flatnessVSAvoidprocessing time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent replaces the chemical bonding mechanism (adhesive bonding to carrier plates) with a mechanical clamping system. The deposition ring portions are raised to engage and clamp the substrate edges, providing the necessary mechanical support to prevent bowing without requiring bonding chemicals or additional bonding/debonding process steps

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Loss of time

If substrates are mechanically clamped to flatten them, then processing time is reduced, but substrate contact may cause sticking or plasma arcing

Engineering Contradiction:

Improveprocessing timeVSAvoidsubstrate sticking and plasma arcing

Core Design Contradiction:

Loss of timeVSObject-affected harmful factors

Solution Approach 1:

The deposition ring portions are configured to contact only specific localized regions of the substrate (at predetermined radial positions), rather than covering the entire substrate surface. This localized engagement provides sufficient mechanical support to prevent bowing while minimizing the contact area, thereby reducing the risk of substrate sticking and plasma arcing

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12100579B2Deposition ring for thin substrate handling via edge clamping

Publication Date: 2024.09.24 APPLIED MATERIALS INC

AI summary

Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned with the second inner ledge along a common plane to form a clamping surface.