Edge Ring Assembly Plasma Direction Control
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Solution Overview
Problem
Inconsistency in plasma direction during semiconductor processes leads to poor uniformity of wafer edge plasma and varying ion bombardment energy, resulting in yield loss due to tilted patterns on wafer edges, especially for wafers fabricated at early or late stages of their lifecycle.
Innovation Solution
A plasma processing system incorporating an edge ring assembly with a base ring, a conductive toroid ring having a polygonal section with flanges, and a cover ring, coupled with a DC or RF power supply, where the power supply settings are adjusted based on the structural integrity of the cover ring to maintain optimal power levels throughout the lifecycle of the edge ring assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the edge ring assembly is used throughout its lifecycle without adjustment, then device complexity is reduced, but manufacturing precision deteriorates due to varying power levels affecting plasma uniformity
Solution Approach 1:
The edge ring assembly transitions from a static component to a dynamic one by implementing adjustable power supply settings that change throughout its lifecycle. The assembly includes monitoring systems and control mechanisms that adapt power levels based on operational stage, allowing the same physical structure to maintain optimal performance characteristics across different usage periods.
Solution Approach 2:
The power supply parameters (voltage, current, frequency) are dynamically adjusted based on the edge ring assembly's lifecycle stage. By changing these electrical parameters rather than the physical structure, the system maintains manufacturing precision without requiring multiple hardware configurations or replacements.
2Manufacturing precision
If power supply settings are adjusted throughout the lifecycle, then manufacturing precision is maintained, but device complexity increases due to additional control mechanisms
Solution Approach 1:
The system incorporates feedback mechanisms that monitor plasma characteristics and power consumption, automatically adjusting power supply settings to maintain optimal performance. This closed-loop control ensures manufacturing precision is maintained while automating the complexity of power management, reducing the need for manual intervention.
Solution Approach 2:
The edge ring assembly includes built-in sensors and control logic that enable it to self-regulate power consumption and maintain optimal performance without external intervention. The system monitors its own operational state and automatically adjusts parameters, making the complexity inherent to the component rather than the overall system.
3Ease of operation
If the edge ring assembly operates without power level adjustments, then ease of operation is maintained, but yield loss increases due to tilted patterns on wafer edges
Solution Approach 1:
The system pre-establishes optimal power supply profiles for different stages of the edge ring assembly's lifecycle. Before each operational phase, the appropriate power settings are automatically configured, eliminating the need for manual adjustment while ensuring optimal performance and preventing yield loss from tilted patterns.
Solution Approach 2:
Manual mechanical adjustment of power settings is replaced with automated electronic control systems. The transition from manual to automated power management maintains ease of operation while significantly improving yield by consistently applying optimal power levels throughout the assembly's lifecycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures consistent plasma direction and energy uniformity across the wafer edge, reducing yield loss by maintaining power levels within specified limits throughout the lifecycle of the edge ring assembly, thereby improving the quality of semiconductor fabrication.
Implementation Method 1
A plasma processing system incorporating an edge ring assembly with a base ring, a conductive toroid ring having a polygonal section with flanges, and a cover ring, coupled with a DC or RF power supply
Implementation Method 2
causes varying energy of ion bombardment
Data Source
AI summary
A plasma processing system has been disclosed. The plasma processing system includes an electrostatic chuck (ESC) and an edge ring assembly. The edge ring assembly has a conductive ring configured to generate an electric field to adjust the direction of ions.