Ejector Assembly for Mass Transfer of Electronic Die
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Solution Overview
Problem
Conventional mechanical die attach machines have low throughput and high costs, making the production of high-resolution LED displays like 8K displays economically impractical due to the time and complexity required for placing millions of individual LEDs.
Innovation Solution
An apparatus and method for transferring electronic components onto a substrate or superstrate using an ejector assembly and press elements to form predefined patterns, allowing for simultaneous assembly of multiple LEDs onto a receiving structure and subsequent attachment to a superstrate with an adhesive layer, enabling higher throughput and reduced manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional mechanical die attach machines are used to place individual LEDs, then placement precision can be maintained, but productivity is extremely low and manufacturing time is excessively long
Solution Approach 1:
The patent segments the die sheet into individual die locations and uses a matrix array of ejector pins that can independently eject specific dies. This allows selective ejection of only the required dies (e.g., 33 million for 8K display) rather than processing all dies, dramatically reducing manufacturing time while maintaining precision through controlled individual ejection.
Solution Approach 2:
The patent replaces conventional mechanical拾取和放置 (pick-and-place) mechanisms with a direct ejection system. Dies are ejected directly from the die sheet onto the substrate through a matrix array of ejector pins, eliminating the need for mechanical grippers, conveyors, and positioning systems, thereby increasing throughput to potentially millions of dies per hour.
2Productivity
If conventional mechanical die attach machines process one light emitter at a time, then device complexity remains manageable, but productivity is severely limited
Solution Approach 1:
The patent merges multiple ejection functions into a single matrix array of ejector pins that can operate simultaneously. The system combines die holding, positioning, and ejection functions into an integrated die sheet structure with pre-formed cavities, reducing the number of separate components and simplifying the overall system while enabling parallel processing of millions of dies.
Solution Approach 2:
The die sheet structure serves multiple functions: it holds all dies in precise positions, provides individual cavities for each die, enables selective ejection of specific dies, and facilitates direct transfer to the substrate. This multi-functionality reduces the need for separate handling, positioning, and attachment systems.
3Manufacturing precision
If high-resolution displays with millions of pixels are manufactured using individual LED placement, then display quality and resolution are achieved, but manufacturing cost becomes prohibitively high
Solution Approach 1:
The patent performs preliminary actions by pre-arranging all dies on the die sheet in their final destination positions before ejection. The die sheet includes pre-formed cavities that hold each die in its exact final position, eliminating the need for complex real-time positioning and alignment systems during manufacturing, thereby reducing costs while maintaining high precision.
Solution Approach 2:
The patent uses a master die sheet template that can be replicated and used to produce multiple substrates. The precise arrangement of dies on the die sheet serves as a template that ensures consistent high-resolution patterns across multiple displays, reducing the need for expensive recalibration and positioning systems for each substrate.
Data Source
AI summary
An apparatus and associated method for high speed and/or mass transfer of electronic components onto a substrate comprises transferring, using an ejector assembly, electronics components (e.g., light emitting devices) from a die sheet onto an adhesive receiving structure to form a predefined pattern including electronic components thereon, and then transferring the electronic components defining the predefined pattern onto a substrate (e.g., a translucent superstrate) for light emission therethrough to create a high-density (e.g., high resolution) display device utilizing, for example, mini- or micro-LED display technologies.