Elastic Clamping Structure for Vertical Flexible Substrate Transfer

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Solution Overview

Problem

Flexible substrates with thicknesses of 0.2 mm to 3 mm are prone to breaking or deformation during transfer and high temperature processing, leading to reduced production efficiency and increased labor and costs.

Innovation Solution

An elastic clamping structure and substrate carrier system that uses a fastener structure with spring-connected clamping members, featuring rolling elements made of materials like plastic, ceramic, or metal alloys, to securely clamp and transfer flexible substrates vertically.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If flexible substrates are transferred horizontally or handled traditionally, then transfer operations can be performed, but the substrates are prone to breaking or deformation due to their thinness (0.2 mm to 3 mm)

Engineering Contradiction:
Improvesubstrate integrityVSAvoidtransfer difficulty
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent changes the transfer dimension from horizontal to vertical orientation. The substrate carrier holds the flexible substrate vertically, allowing transfer through the tool end of a transfer device in the vertical direction, which prevents the substrate from bending or deforming during transfer operations

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent uses a flexible cover that can elastically deform to accommodate the substrate. The cover's flexibility allows it to conform to the substrate shape while providing protection, and its elastic properties enable it to return to its original position after clamping or support operations

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If flexible substrates undergo high temperature drying process in baking oven, then drying can be achieved, but the substrates break or deform due to thermal expansion

Engineering Contradiction:
Improvesubstrate integrityVSAvoidthermal expansion
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent uses a cover made of material with substantially the same expansion and thermal conductivity as the flexible substrate. This homogeneity in thermal properties ensures that the cover and substrate expand and contract at similar rates during high temperature processing, preventing differential stress that would cause substrate breakage or deformation

Inventive Principle:
Principle #33Homogeneity

Solution Approach 2:

The patent employs composite material selection where the cover material is specifically chosen to match the substrate's thermal characteristics. This creates a thermally compatible composite structure that withstands high temperature drying processes without causing substrate damage

Inventive Principle:
Principle #40Composite materials

3Reliability

If clamping structures are designed to securely hold thin substrates, then substrate stability is improved, but the structure becomes more complex

Engineering Contradiction:
Improveclamping stabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses a spring member to provide elastic clamping force, making the clamping structure dynamic rather than rigid. The spring automatically adjusts the clamping force to maintain secure holding of the substrate while accommodating minor position variations, achieving stable clamping with a relatively simple structure

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The spring member provides self-adjusting clamping force that automatically adapts to the substrate's position and dimensions. The elastic element continuously applies force to maintain contact and stability without requiring complex control mechanisms or multiple adjustment components

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively prevents damage to flexible substrates during transfer and high temperature processing by maintaining vertical orientation and using materials with similar thermal expansion and conductivity, thereby enhancing production efficiency and reducing costs.

Implementation Method 1

an opposite end of the clamping member is connected to one end of the cover through a spring member

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

The clamping member has two opposite ends thereof respectively mounted with a rolling element

Methodology Applied
Scientific EffectRolling friction: Friction

Data Source

PatentUS20250121509A1Elastic clamping structure and substrate carrier
Publication Date: 2025.04.17 GRP UP IND CO LTD
  • US20250121509A1 patent drawing
  • US20250121509A1 patent drawing
  • US20250121509A1 patent drawing

AI summary

An elastic clamping structure for mounting on a load-bearing member is disclosed to include a fastener structure, which has each of both ends thereof fixed to the load-bearing member through a fastener, and a clamping structure, which has one end connected to the. fastener structure through a spring member, the other end provided with a clamping member and the central body formed by a cover. The clamping member has both ends respectively mounted with a rolling element and a middle part connected to one end of the cover. The other end of the cover is close to the fastener structure. The clamping member is in the shape of a long strip.