Conductive Elastic Plate EMI Shielding for Semiconductor Packages
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Solution Overview
Problem
Semiconductor packages face challenges in effectively shielding electromagnetic interference (EMI) to prevent interference between integrated circuits and the human body, particularly in mobile and wearable devices, where existing solutions are inadequate in blocking EMI at the semiconductor package level.
Innovation Solution
A semiconductor package manufacturing method involving a package substrate with through slits and conductive guard rails, combined with a conductive elastic plate forming an EMI shielding cage, where the elastic plate's wing portions are bent and inserted into trenches, utilizing elastic restoring force for secure attachment and EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional EMI shielding structure is used, then EMI protection is provided, but additional adhesive members and complex assembly processes are required
Solution Approach 1:
The patent combines the EMI shielding cage and the attachment structure into a single integrated component. The conductive elastic plate serves dual purposes: providing EMI shielding and mechanically attaching to the substrate through its own elastic deformation, eliminating the need for separate adhesive members or fasteners.
Solution Approach 2:
The conductive elastic plate attaches itself to the substrate through its own elastic restoring force. When the plate is bent to insert edge portions into the through slits, the elastic material naturally exerts a restoring force that secures the attachment without requiring external adhesives or additional assembly steps.
2Object-affected harmful factors
If rigid shielding structures are used, then EMI protection is provided, but flexibility and ease of attachment are reduced
Solution Approach 1:
The patent transitions from a rigid shielding structure to a dynamic, flexible one. The conductive elastic plate can be bent during assembly to facilitate insertion into the through slits, and then naturally returns to its original shape through elastic restoring force, providing both ease of attachment and secure fixation.
Solution Approach 2:
The EMI shielding cage is constructed from a flexible conductive elastic plate rather than rigid materials. This flexible plate can be deformed during assembly and maintains secure attachment through its elastic properties, combining the EMI shielding function with mechanical flexibility and ease of installation.
3Reliability
If additional adhesive members are used for attachment, then secure fixation is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The conductive elastic plate attaches itself to the substrate through its own elastic restoring force. When bent during assembly, the material naturally exerts a restoring force that secures the edge portions in the through slits, eliminating the need for external adhesive members and simplifying the manufacturing process.
Solution Approach 2:
The patent extracts and eliminates the need for separate adhesive members from the assembly process. The attachment function is achieved entirely through the elastic properties of the conductive plate itself, removing unnecessary components and simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields semiconductor devices from EMI both laterally and vertically, providing reliable protection without additional adhesive members, suitable for use in mobile and wearable devices.
Implementation Method 1
the edge portions of the conductive elastic plate are supported to be inserted into the trenches by a force trying to stretch by an elastic restoring force of the conductive elastic plate
Implementation Method 2
arranging a conductive elastic plate over the package substrate to form an EMI shielding cage
Data Source
AI summary
A method for manufacturing a semiconductor package and the semiconductor package are provided. The method for manufacturing a semiconductor package may include arranging a conductive elastic plate over a package substrate including through slits disposed along edges of a chip mounting region and a conductive guard rails providing a concave trench shape, and bending the conductive elastic plate. Edge portions of the conductive elastic plate may be inserted into the trenches of the conductive guard rails and supported by the conductive guard rails by a force trying to stretch by the elastic restoring force of the wing portions of the conductive elastic plate.