Elastic Resin Housing for Heat Diffusion Plate Contact
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Solution Overview
Problem
Existing heat dissipation devices for electronic components face challenges in achieving high dimensional accuracy of the housing while ensuring tight contact between the resin housing and the heat diffusion plate, leading to increased thickness of heat conductive materials and reduced heat dissipation efficiency.
Innovation Solution
A heat dissipation device comprising a heat diffusion plate, a resin unit with a contact portion, an outer frame portion, and a deformation portion, where the deformation portion elastically deforms to maintain close contact with the heat diffusion plate, preventing deformation of the outer frame portion and allowing for a smaller gap between the heat diffusion plate and the electronic component, thus improving heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the housing is made rigid to maintain high dimensional accuracy, then manufacturing precision is improved, but the ability to achieve tight contact with the heat diffusion plate deteriorates
Solution Approach 1:
The housing is segmented into a rigid outer frame portion and a flexible resin unit portion. The outer frame portion maintains dimensional accuracy and structural stability, while the resin unit portion makes contact with the heat diffusion plate and can deform elastically to ensure tight contact. This segmentation allows each part to fulfill its specific function without compromise.
Solution Approach 2:
Different parts of the housing have different mechanical properties. The outer frame portion is designed to be rigid for dimensional stability, while the resin unit portion is designed to be flexible for conformal contact. This local differentiation of material properties resolves the contradiction between rigidity and flexibility requirements.
2Loss of energy
If the gap between the heat diffusion plate and electronic component is reduced to improve heat transfer, then heat dissipation efficiency is improved, but the risk of deformation and contact issues increases
Solution Approach 1:
The resin unit's elastic properties are utilized to accommodate minor dimensional variations and maintain consistent contact pressure. By changing the mechanical parameters of the contact portion (making it elastic rather than rigid), the system can achieve reliable thermal contact without requiring extremely tight manufacturing tolerances on the gap dimensions.
3Reliability
If the housing is designed to accommodate deformation for tight contact, then contact reliability is improved, but the overall housing dimensional accuracy may deteriorate
Solution Approach 1:
The housing is divided into deformation-capable resin unit and dimensionally-stable outer frame. This segmentation isolates the deformation function to a specific region, allowing the rest of the housing to maintain high dimensional accuracy for mounting and assembly purposes.
Solution Approach 2:
The flexible deformation capability is localized to the resin unit portion that contacts the heat diffusion plate, while the outer frame portion maintains rigid dimensional specifications. This local flexibility vs. global rigidity approach resolves the contradiction between contact reliability and overall dimensional accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation with reduced thermal resistance, allows for a smaller housing size, and maintains high dimensional accuracy of the housing, enhancing the overall performance and cost-effectiveness of the electronic device.
Implementation Method 1
a first surface of a heat diffusion plate is overlapped with an electronic component through a heat conductive material
Implementation Method 2
a deformation portion is provided between the outer frame portion and the contact portion, and is configured to elastically deform when the contact portion is pressed against the second surface
Implementation Method 3
The heat diffusion plate has the first surface overlapped on the electronic component through a heat conductive material to diffuse heat
Implementation Method 4
The heat is radiated as electromagnetic waves to the atmosphere via the housing
Implementation Method 5
or is diffused by convection of air
Data Source
AI summary
A heat dissipation device includes a heat diffusion plate, a resin unit, and a connecting unit. The heat diffusion plate is configured such that the first surface is overlapped with an electronic component via a heat conductive material. The resin unit integrally includes a contact portion, an outer frame portion, and a deformation portion. The contact portion is configured so that at least a part thereof can make surface contact with the second surface of the heat diffusion plate opposite from the first surface. The outer frame portion is configured to surround the contact portion with a gap from the surroundings to form a part of a housing surrounding the electronic component and the heat diffusion plate. The deformation portion is provided between the outer frame portion and the contact portion, and is configured to elastically deform when the contact portion is pressed against the second surface.