Elastic Retainer Heat Sink Fastening Force Control
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Solution Overview
Problem
Existing heat dissipation devices face challenges in achieving a controlled fastening force for efficient heat dissipation, as excessive force can damage electronic devices while insufficient force results in low heat-dissipation efficiency.
Innovation Solution
A heat dissipation device with a retainer that includes a frame, baffle walls, and protrusion posts, where elastic members are used to compress between the retainer and the heat sink, allowing for adjustable and appropriate force distribution to securely attach the heat sink to the electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the retainer presses downwardly against the heat sink with large force, then the heat-dissipation efficiency is improved, but the electronic device may be damaged
Solution Approach 1:
The patent changes the force parameter from fixed to variable by introducing elastic members (springs) that can adjust the pressing force according to the heat sink's position and the electronic device's tolerance, thereby optimizing heat dissipation while preventing damage
Solution Approach 2:
The retainer structure transitions from a static rigid frame to a dynamic system with elastic members that can automatically adjust the fastening force, allowing the system to adapt to different mounting conditions and protect the electronic device from excessive force
2Object-affected harmful factors
If the retainer presses downwardly against the heat sink with small force, then the electronic device is protected from damage, but the heat-dissipation efficiency is reduced
Solution Approach 1:
The elastic members enable the pressing force parameter to be dynamically adjusted within a safe range, ensuring sufficient contact pressure for effective heat transfer while remaining below the damage threshold of the electronic device
3Reliability
If the fastening force is increased to ensure tight attachment, then the heat-dissipation efficiency is improved, but the risk of damaging the electronic device increases
Solution Approach 1:
The elastic members act as cushioning elements that pre-compress between the retainer and heat sink, providing a controlled fastening force that ensures tight attachment beforehand while preventing excessive force that could damage the electronic device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a tight and efficient attachment of the heat sink to the electronic device, providing optimal heat dissipation while minimizing the risk of damage, by allowing for precise control of the fastening force through the elastic members.
Implementation Method 1
a plurality of elastic members which are respectively mounted around the protrusion posts of the retainer and are located and compressed between the retainer and the heat sink
Data Source
AI summary
A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.