Elastic Wave Filter Stack Using SiNx to Suppress High-Order Modes

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Solution Overview

Problem

Elastic wave devices with stacked supporting substrates, high-acoustic-velocity films, and piezoelectric films generate high-order-mode unwanted waves and frequency changes due to variations in the physical properties of the high-acoustic-velocity film materials, particularly silicon nitride, which can interfere with other filter devices connected to an antenna.

Innovation Solution

The elastic wave device is designed with a high-acoustic-velocity film made of SiNx where x<0.67, a low-acoustic-velocity film of silicon oxide, and a piezoelectric layer, where the acoustic velocities are optimized to confine energy within the piezoelectric layer, reducing high-order-mode unwanted waves and frequency changes, and optionally includes a second low-acoustic-velocity film and an insulating film for improved temperature characteristics and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a high-acoustic-velocity film made of silicon nitride is used in the stacked structure, then the acoustic velocity of bulk waves is increased, but high-order-mode unwanted waves are generated and frequency changes occur due to variations in physical properties

Engineering Contradiction:
Improveacoustic velocity of bulk wavesVSAvoidfrequency stability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent changes the compositional parameter x in SiNx from the conventional range (x≥0.67) to a specific range (0.1≤x<0.67). This parameter change reduces the acoustic velocity of bulk waves in the high-acoustic-velocity film, preventing high-order-mode unwanted waves while maintaining the desired acoustic wave propagation characteristics in the piezoelectric layer.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies different materials with specific acoustic velocity characteristics to different layers: SiNx with 0.1≤x<0.67 for the high-acoustic-velocity film, silicon oxide for the low-acoustic-velocity film, and aluminum nitride for the piezoelectric layer. This local differentiation of material properties confines acoustic wave energy to the piezoelectric layer and eliminates high-order-mode interference.

Inventive Principle:
Principle #3Local quality

2Speed

If the physical properties of silicon nitride in the high-acoustic-velocity film are changed, then the acoustic velocity is adjusted, but a change in high-order-mode frequency occurs

Engineering Contradiction:
Improveacoustic velocityVSAvoidhigh-order-mode frequency control
Core Design Contradiction:
SpeedVSManufacturing precision

Solution Approach 1:

The patent establishes a specific compositional parameter range (0.1≤x<0.67) for SiNx that simultaneously achieves the desired acoustic velocity and prevents high-order-mode frequency changes. By controlling the nitrogen content within this range, both acoustic velocity and frequency stability are optimized.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces or prevents high-order-mode unwanted waves and frequency changes, minimizing interference with other filter devices and enhancing temperature stability, as demonstrated by reduced frequency shifts and wave levels in high-humidity environments.

Implementation Method 1

a piezoelectric layer disposed on the low-acoustic-velocity film

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

the acoustic velocity of a bulk wave that propagates through the high-acoustic-velocity film is higher than the acoustic velocity of an elastic wave that propagates through the piezoelectric layer, the acoustic velocity of a bulk wave that propagates through the low-acoustic-velocity film is lower than the acoustic velocity of an elastic wave that propagates through the piezoelectric layer

Methodology Applied
Scientific EffectAcoustic wave confinement: Speed of Sound

Data Source

PatentUS10491187B2Elastic wave device, multiplexer, high-frequency front-end circuit, and communication apparatus
Publication Date: 2019.11.26 MURATA MFG CO LTD
  • US10491187B2 patent drawing
  • US10491187B2 patent drawing
  • US10491187B2 patent drawing

AI summary

An elastic wave device includes a supporting substrate, a high-acoustic-velocity film disposed on the supporting substrate, a low-acoustic-velocity film disposed on the high-acoustic-velocity film, a piezoelectric layer disposed on the low-acoustic-velocity film, and an interdigital transducer electrode disposed on the piezoelectric layer. The acoustic velocity of a bulk wave that propagates through the high-acoustic-velocity film is higher than the acoustic velocity of an elastic wave that propagates through the piezoelectric layer. The acoustic velocity of a bulk wave that propagates through the low-acoustic-velocity film is lower than the acoustic velocity of an elastic wave that propagates through the piezoelectric layer. The high-acoustic-velocity film is composed of SiNx, where x&lt;about 0.67.