Elastic Wave Element Connection Wiring Reinforcement
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Solution Overview
Problem
Conventional elastic wave elements experience significant electric loss in connection wiring due to insufficient reinforcement, primarily because the reinforcement electrode is only provided on the upper surface, which does not adequately reduce electric resistance.
Innovation Solution
The elastic wave element incorporates a reinforcement electrode that is in contact with and electrically connected to both the upper and lower connection wirings, with a hole electrode extending through both, and materials with varying oxygen affinity to minimize oxide film formation and enhance electrical connection, thereby reducing electric loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the reinforcement electrode is only provided on the upper surface of the connection wiring, then the device complexity is reduced, but the electric loss in the connection wiring is significant
Solution Approach 1:
The reinforcement electrode is extended from a two-dimensional surface configuration to a three-dimensional structure that penetrates through the connection wiring via hole electrodes. This dimensional change allows the reinforcement electrode to make contact with both the upper and lower connection wirings, thereby reducing electric loss without significantly increasing device complexity.
Solution Approach 2:
The hole electrode is nested within the connection wiring structure, allowing the reinforcement electrode to pass through the upper connection wiring and reach the lower connection wiring. This nesting approach enables effective electrical connection through multiple layers while maintaining a compact design.
2Loss of energy
If the reinforcement electrode contacts both upper and lower connection wirings, then the electric loss is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The hole electrode is formed in advance within the connection wiring structure, creating a predetermined pathway for the reinforcement electrode. This preliminary action ensures that the reinforcement electrode can accurately contact both the upper and lower connection wirings without requiring high-precision alignment during subsequent manufacturing steps, thereby reducing manufacturing precision requirements.
3Reliability
If materials with varying oxygen affinity are used for upper and lower connection wirings, then oxide film formation is minimized, but the device complexity increases
Solution Approach 1:
Different materials with varying oxygen affinity are used for the upper and lower connection wirings based on their specific functional requirements. The lower connection wiring uses a material with low oxygen affinity to prevent oxide film formation at the critical interface with the reinforcement electrode, while the upper connection wiring can use a different material. This localized material selection improves electrical connection reliability without requiring all components to use complex material compositions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces electric loss in the connection wiring by ensuring effective contact between the reinforcement electrode and the connection wirings, leading to lower contact resistance and reduced oxide film interference, thereby improving the overall performance of the elastic wave element.
Implementation Method 1
a reinforcement electrode provided above the connection wiring, the reinforcement electrode being in contact with and electrically connected to the lower connection wiring
Data Source
AI summary
Methods and apparatus for reducing electric loss in an elastic wave element. In one example such a method includes forming an IDT electrode on a piezoelectric body, and forming the connection wiring on the piezoelectric body and electrically connecting the connection wiring to the IDT electrode. Forming the connection wiring includes sequentially forming a lower connection wiring on an upper surface of the piezoelectric body and forming an upper connection wiring over the lower connection wiring. The method further includes forming a reinforcement electrode over the connection wiring that divides the upper connection wiring into first and second upper connection wirings electrically connected to one another by the reinforcement electrode. The reinforcement electrode is formed abutting an upper surface of the lower connection wiring between the first and second upper connection wirings and electrically connected to the lower connection wiring and to the first and second upper connection wirings.