Elastomeric Connector for Thermal Expansion Mismatch in IC Packaging
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Solution Overview
Problem
Current computer chip architectures face challenges in efficiently processing large volumes of data required for advanced artificial intelligence and machine learning applications, leading to inefficiencies and high economic costs due to inadequate data processing capabilities in existing semiconductor systems.
Innovation Solution
An integrated circuit architecture featuring a semiconductor wafer with a specific coefficient of thermal expansion, an electronic circuit substrate with a different coefficient, and an elastomeric connector that forms operable signal communication paths between them, enabling enhanced data processing and addressing thermal expansion mismatches during packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If traditional rigid connectors are used to connect semiconductor wafers to circuit substrates, then structural stability is improved, but thermal stress damage occurs due to coefficient of thermal expansion mismatch
Solution Approach 1:
The patent employs an elastomeric connector with a flexible membrane structure that can elastically deform to accommodate thermal expansion differences between the semiconductor wafer and circuit substrate. The membrane contains conductive elements that maintain electrical connectivity while the elastomeric material absorbs thermal stress through elastic deformation, preventing connector failure under thermal cycling conditions.
Solution Approach 2:
The patent changes the physical parameters of the connector by using an elastomeric material with specific mechanical properties (elastic modulus, Poisson's ratio) that allow it to deform under thermal stress. The connector's ability to change shape and absorb stress through elastic deformation resolves the contradiction between maintaining structural stability and withstanding thermal expansion mismatch.
2Productivity
If multiple die are connected through a circuit substrate, then data processing bandwidth is improved, but signal latency increases due to indirect communication paths
Solution Approach 1:
The patent merges multiple die into a wafer-scale array that communicates directly through the wafer substrate itself rather than through external circuit boards. This integration allows signals to travel directly between adjacent die within the wafer, eliminating the need for external routing and reducing signal latency while maintaining high bandwidth through parallel communication paths.
Solution Approach 2:
The patent transitions from two-dimensional circuit board mounting to three-dimensional wafer-scale integration, where multiple die are arranged in a dense array on a single wafer. This dimensional change enables direct vertical and lateral communication paths between die, reducing signal travel distance and latency while increasing processing bandwidth through parallel data flow.
3Productivity
If wafer-scale integration is implemented, then data processing capability is improved, but manufacturing complexity increases due to packaging challenges
Solution Approach 1:
The patent introduces an elastomeric connector as an intermediary component that simplifies the packaging process. This connector serves as a mediator between the wafer and the external circuit substrate, providing both mechanical support and electrical connectivity. The elastomeric material's flexibility allows for easier assembly and alignment, reducing manufacturing complexity despite the advanced wafer-scale integration.
Solution Approach 2:
The elastomeric membrane acts as a flexible interface layer that simplifies packaging by accommodating misalignments and thermal expansions. This flexible film structure enables easier assembly processes compared to rigid connectors, reducing the complexity of handling and installing wafer-scale integrated circuits while maintaining reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances data processing efficiency and bandwidth, reducing latency and operational costs by allowing direct communication between multiple die on a single substrate and effectively managing thermal expansion differences between silicon and organic substrates, thereby improving the performance and reliability of large silicon die packaging.
Implementation Method 1
a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion
Implementation Method 2
an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate
Implementation Method 3
an elastomeric connector that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate
Data Source
AI summary
An integrated circuit assembly that includes a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; and an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate and that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate.