Elastomeric Stamp Deposition on Non-Planar Substrates

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Solution Overview

Problem

Existing methods fail to effectively deposit patterned metal layers on non-planar substrates without damaging the substrate or the deposited materials due to deformation, limiting the formation of arbitrarily-shaped devices in applications like organic light emitting and photosensitive devices.

Innovation Solution

An elastomeric stamp is used, which can be deformed with a vacuum mold to conform to non-planar substrates, allowing material deposition while minimizing strain on the coating by maintaining contact and applying pressure through elasticity, enabling the transfer of materials onto substrates with two-dimensional curvature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If material is deposited on a flexible substrate and then deformed into a desired configuration, then arbitrarily-shaped devices can be formed, but the substrate and/or deposited layers may be damaged or destroyed due to excessive deformation

Engineering Contradiction:
Improveability to form arbitrarily-shaped devicesVSAvoidintegrity of substrate and deposited layers
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The elastomeric stamp is pre-deformed into the desired non-planar configuration before material deposition. This preliminary shaping allows the stamp to maintain its deformed state during coating, ensuring the deposited material conforms to the target shape without requiring post-deposition deformation that could damage the substrate or layers

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

An elastomeric stamp with flexible properties is used as an intermediary carrier for material deposition. The stamp's elasticity allows it to be deformed into complex shapes, maintain conformal contact with non-planar substrates, and transfer materials smoothly without causing damage to the substrate or deposited layers

Inventive Principle:
Principle #30Flexible shells and thin films

2Manufacturing precision

If a rigid stamp is used for material deposition, then precise patterning can be achieved, but the stamp cannot conform to non-planar substrates

Engineering Contradiction:
Improvepatterning precisionVSAvoidability to deposit on non-planar substrates
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent employs a flexible elastomeric stamp instead of a rigid stamp. This flexible stamp can be deformed into various configurations and maintains conformal contact with non-planar substrates, enabling material deposition on curved and three-dimensional surfaces while preserving patterning capability

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The physical state of the stamp is changed from rigid to flexible elastomeric material. This parameter change in the stamp's mechanical properties allows it to adapt its shape to match non-planar substrates while still providing precise material transfer through controlled deformation and elastic recovery

Inventive Principle:
Principle #35Parameter changes

3Shape

If the stamp is deformed to match the substrate shape, then conformal contact is achieved, but strain may be applied to the deposited material coating

Engineering Contradiction:
Improveconformal contact with substrateVSAvoidintegrity of deposited material coating
Core Design Contradiction:
ShapeVSStrength

Solution Approach 1:

The stamp is deformed into the desired non-planar configuration before material deposition. By pre-shaping the stamp to match the substrate geometry, the deposited material is laid down in its final conformal configuration without requiring subsequent deformation that would strain or damage the coating

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The elastomeric stamp's flexibility allows it to be deformed into complex shapes while maintaining uniform stress distribution. When the stamp is pre-deformed and then used for deposition, the material transfers smoothly without concentrated strain points, preserving the integrity of thin and sensitive coatings

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the successful deposition of patterned metal layers on non-planar substrates, reducing the risk of damage and enabling the fabrication of sensitive optoelectronic devices like photodetectors and OLEDs with smooth, thin metal layers, suitable for small-scale and sensitive materials.

Implementation Method 1

The elastomeric stamp may be deformed with a vacuum mold

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

when the vacuum is released or decreased the stamp may become less deformed, i.e., more planar

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

When pressure is applied, the material on the stamp may be transferred to the substrate

Methodology Applied
Scientific EffectPressure: Pressure Increase

Data Source

PatentEP2122705B1Method for depositing thin layers on non-planar substrates by stamping
Publication Date: 2016.05.04 THE TRUSTEES OF PRINCETON UNIV
  • EP2122705B1 patent drawingFigure 1A~1C
  • EP2122705B1 patent drawingFigure 2
  • EP2122705B1 patent drawingFigure 3

AI summary

An elastomeric stamp is used to deposit material on a non-planar substrate. A vacuum mold is used to deform the elastomeric stamp and pressure is applied to transfer material from the stamp to the substrate. By decreasing the vacuum applied by the vacuum mold, the elasticity of the stamp may be used to apply this pressure. Pressure also may be applied by applying a force to the substrate and/or the stamp. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer.