Electric Module Assembly via Segmented Bonding to Prevent Thermal Damage

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Solution Overview

Problem

Existing methods for cooling and fixing electrical components with ferromagnetic material are hindered by the polymerization of heat-conductive bonding compounds at high temperatures, which can damage heat-sensitive components.

Innovation Solution

A method for fabricating an electric module by fixing one type of electrical component to a plate using a polymerizable bonding compound, then assembling it with an electrical connecting bar, ensuring the heat-sensitive components are not exposed to the high temperatures required for polymerization, and using a secondary plate for heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat-conductive bonding compound is used to fix electrical components to a cooling plate, then heat dissipation efficiency is improved, but heat-sensitive components are damaged due to polymerization at high temperature

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcomponent damage from high temperature

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent divides the assembly process into two separate stages: first fixing heat-sensitive components to the connecting bar without high-temperature bonding, then separately fixing heat-resistant components to the cooling plate using high-temperature polymerizing bonding compound. This segmentation allows each component type to be processed under appropriate temperature conditions, resolving the contradiction between heat dissipation efficiency and component protection.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary fixation of heat-sensitive components to the electrical connecting bar before the high-temperature bonding process. By preparing the assembly in advance with components positioned correctly but not yet subjected to high heat, the method prevents thermal damage while maintaining the eventual heat dissipation pathway through the bonding compound between the plate and connecting bar.

Inventive Principle:

Principle #10Preliminary action

2Strength

If high temperature is applied to polymerize the bonding compound, then bonding strength is improved, but heat-sensitive components cannot withstand the temperature

Engineering Contradiction:

Improvebonding strengthVSAvoidcomponent integrity

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent segments the bonding operations into two distinct groups: heat-sensitive components bonded to the connecting bar at lower temperatures, and heat-resistant components bonded to the cooling plate at high temperatures. This segmentation enables each bonding operation to occur at optimal temperature conditions, achieving strong bonds without compromising component integrity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The electrical connecting bar serves as an intermediary element that receives heat-sensitive components through low-temperature bonding, then assembles these to the cooling plate structure. This intermediary approach allows heat-sensitive components to be part of the final assembly without direct exposure to high-temperature bonding processes, maintaining both bonding strength and component reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the secure fixing of both fragile and heat-sensitive components without damaging them, simplifies the production process, and effectively dissipates heat, enabling the creation of a robust and efficient electrical system.

Implementation Method 1

the heating of the bonding compound, for example to a temperature of at least 125° C., preferably of at least 150° C., for polymerizing the bonding compound

Methodology Applied

Scientific EffectPolymerization: Photopolymerisation

Implementation Method 2

the first plate is designed to dissipate the heat generated by the first component or components during their operation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

a circulation channel for coolant liquid and an access opening into the channel are formed in the second plate, and the first plate is fixed to the second plate in such a manner as to cover the opening, in order for the coolant liquid to come into contact with the first plate

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10912223B2Electric module, electrical system comprising such an electric module, and corresponding production methods

Publication Date: 2021.02.02 VALEO SIEMENS EAUTOMOTIVE FRANCE SAS

AI summary

The method for producing the electric module comprises: securing at least one first electrical component (108, 110) to a first plate (102); then assembling each first electrical component (108, 110) to an electrical connection bar (104) to which at least one second component (120) is already secured.