Conversion Constructional Details TRIZ Cases

Vertical flat connecting terminal boards offset magnetic fluxes to reduce parasitic inductances and surge voltages in high-speed switching circuits.

Integrating AC and DC windings into a single core reduces device complexity while enabling bi-directional power flow for efficient vehicle-to-grid charging.

A power converter cooling plate features an intra-plate pathway for coolant flow perpendicular to the stacking direction.

A segmented assembly method fixes heat-sensitive components to a connecting bar before high-temperature polymerization bonds the module to a cooling plate.

Segmented U-shaped magnetic parts focus fields around phase conductors, resolving thermal shock deterioration and reducing production costs.

Orthogonal terminal placement on a semiconductor package enables simple wiring, eliminating complex multi-layer substrate requirements.

Single substrate routing layer integrates power devices and capacitors to reduce parasitic inductance, lowering switching losses.

Integrating a coolant channel into a unitary seat member reduces part count and assembly steps while minimizing pressure loss in the cooling circuit.

An integrated capacitor module reduces inductance and heat generation while enabling compact power inverter designs.

Nesting a capacitor bank vertically over high-power switching modules minimizes parasitic inductance, reducing voltage spikes and electromagnetic interference.

A double-sided heat transfer system immerses semiconductor dies in dielectric fluid to remove thermal energy via natural circulation.

Segmenting the inverter stage from the DC link reduces system footprint and weight while maintaining scalable voltage capability.

Positive and negative conductor plates face an intermediate potential conductor plate to increase overlap area.

Air guide configuration channels airflow to resolve pressure loss and bypass issues, ensuring effective cooling at low speeds.

Slits and holes in metal layers balance parasitic inductance variations among parallel MOSFETs to reduce switching loss.

Mirror-symmetric wiring patterns in a power semiconductor module suppress current unbalance and maintain low inductance across parallel elements.

Overlapping terminals in stacked power converters allow opposite currents to cancel magnetic fields, reducing surge voltages from high-frequency switching.

A submodule bypass switch uses a pyrotechnic force element to actuate a vacuum interrupter.

Thin plate lead extends from base part to detect semiconductor potential, eliminating complex signal line routing and reducing component count.

Connecting area between transistors minimizes wire inductance, resolving insufficient surge voltage absorption.

A capacitor acts as a structural member fixed to frames in a power conversion apparatus.

A cancellation circuit cancels potential fluctuations on the bias line caused by switch noise, stabilizing the internal clock duty cycle.

A voltage-source converter full bridge module arranges IGBTs on two parallel surfaces to reduce lateral footprint.

Wire harnesses replace bus bars to isolate heat transfer from discharge resistors, improving thermal management and reducing manufacturing complexity.

A semiconductor package integrates an output inductor using conductive leads and a magnetic core within the structure.

Liquid cooled cold plate manages heat from silicon carbide components, achieving 27 kW/L power density.

Inverting the wiring path along the case bottom face shortens connections, reduces inductance, and improves heat dissipation for reliable high-speed switching.

Offset nested bus bars reduce inductance and noise pickup while supporting high current handling capabilities exceeding 400 amps RMS.