Embedded Output Inductor in Semiconductor Package
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Solution Overview
Problem
Conventional power converter implementations on printed circuit boards require significant area due to the need for a side-by-side layout of the power converter switching stage and output inductor, leading to space inefficiencies.
Innovation Solution
A semiconductor package with an embedded output inductor, where the inductor is integrated into the package by using a conductive carrier structure with magnetic material as the core and conductive leads forming windings, reducing the need for external inductor space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the output inductor is implemented as a separate external component on the PCB, then the inductor can be independently optimized and replaced, but the PCB surface area required for the power converter increases significantly
Solution Approach 1:
The patent merges the output inductor with the semiconductor package by integrating the inductor winding around the magnetic core directly into the package structure. The conductive leads of the semiconductor package form the inductor winding, and the magnetic core is positioned within the package, combining two previously separate components (power switch package and external inductor) into a single integrated unit. This eliminates the need for separate PCB mounting of the inductor, thereby reducing PCB surface area.
Solution Approach 2:
The patent implements nesting by placing the magnetic core inside the semiconductor package structure, with the conductive leads forming windings that surround the magnetic core. The inductor is effectively nested within the package housing, with the magnetic core positioned centrally and the conductive leads arranged around it. This nested configuration allows the inductor to occupy the same spatial envelope as the power switch package, eliminating the need for additional external PCB space.
2Ease of manufacture
If the semiconductor package and output inductor are placed side-by-side on the PCB, then each component can be independently manufactured and tested, but the overall system size and PCB area increase
Solution Approach 1:
The patent combines the manufacturing processes by integrating the inductor formation into the semiconductor package manufacturing sequence. The magnetic core is positioned and the conductive leads are configured to form the inductor winding during the same package assembly process, rather than manufacturing separate components for later PCB mounting. This merged approach maintains manufacturing efficiency while eliminating the need for separate PCB placement of the inductor.
3Area of stationary object
If the inductor is integrated into the semiconductor package, then PCB surface area is reduced, but the package design and fabrication process becomes more complex
Solution Approach 1:
The patent uses nesting to simplify the integration complexity by organizing components in a hierarchical manner: the magnetic core is nested within the package housing, and the conductive leads are arranged to form windings around the magnetic core. This nested structure provides a clear spatial organization that guides the fabrication process, with the magnetic core positioned centrally and the leads routed around it in a systematic pattern, making the integrated design more manageable despite the increased complexity.
Solution Approach 2:
The patent applies local quality by optimizing specific regions of the package for different functions: the central region houses the magnetic core with concentrated magnetic material, while the peripheral regions contain the conductive leads arranged for optimal winding geometry. The package housing provides localized structural support and magnetic shielding where needed. This regional optimization allows the integrated inductor to achieve desired electrical characteristics without requiring complex overall package redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a compact design that reduces the printed circuit board surface area required for power converter implementations, enhancing space efficiency and enabling smaller, more compact power converter systems.
Implementation Method 1
an embedded output inductor 404 integrated into the semiconductor package 402, with the inductor including a magnetic core 474 and windings 468a-468j, 488a formed by conductive leads
Implementation Method 2
windings 468a-468j, 488a formed by conductive leads
Data Source
AI summary
In one implementation, a semiconductor package includes a control transistor and a sync transistor of a power converter switching stage attached over a first patterned conductive carrier, as well as a magnetic material situated over leads of the first patterned conductive carrier. The semiconductor package also includes a second patterned conductive carrier attached over the first patterned conductive carrier, the control and sync transistors, and the magnetic material. Leads of the second patterned conductive carrier overlie the magnetic material and are coupled to the leads of the first patterned conductive carrier so as to form windings of an output inductor for the power converter switching stage, the output inductor being integrated into the semiconductor package.