Power Conversion Module Single Substrate Routing Reduces Parasitic Inductance
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Solution Overview
Problem
Conventional power conversion modules face issues with high parasitic inductance due to multiple substrates, increased cost, process complexity, and reliability concerns, which lead to higher switching losses and reduced efficiency.
Innovation Solution
A power conversion module with all devices arranged on a single substrate, featuring a routing layer and insulating layer with specific current paths to reduce parasitic inductance, eliminating the need for additional substrates and simplifying the process, thereby reducing cost and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple substrates are used to arrange devices, then device arrangement flexibility is improved, but parasitic inductance increases and manufacturing complexity increases
Solution Approach 1:
The patent merges multiple substrates into a single substrate structure, integrating device arrangement layers with routing layers. This consolidation eliminates the need for separate substrates while maintaining device arrangement flexibility through multi-layer routing design, thereby reducing manufacturing complexity and parasitic inductance.
Solution Approach 2:
The patent transitions from a planar single-substrate arrangement to a three-dimensional multi-layer substrate structure. By utilizing vertical stacking of routing layers (first routing layer, second routing layer, third routing layer) with different current flow directions, the design achieves flexible device arrangement in multiple dimensions while keeping all components on one physical substrate.
2Adaptability or versatility
If multiple substrates are used for device arrangement, then device placement flexibility is improved, but module size and height increase
Solution Approach 1:
The patent implements a nested structure where multiple routing layers are stacked vertically within a single substrate, similar to nested dolls. The first routing layer, second routing layer, and third routing layer are arranged in vertical tiers, with each layer containing devices and routing paths. This nested arrangement provides placement flexibility equivalent to multiple substrates while consolidating the volume into one compact module.
3Ease of manufacture
If conventional routing patterns are used, then manufacturing is simpler, but parasitic inductance is higher
Solution Approach 1:
The patent applies different routing patterns in different local regions of the substrate. Specifically, the first routing layer uses a first routing pattern, the second routing layer uses a second routing pattern, and the third routing layer uses a third routing pattern. Each local region's routing pattern is optimized for its specific function, allowing complex current paths that reduce parasitic inductance while maintaining manufacturability through standardized layer fabrication.
4Adaptability or versatility
If additional substrates are added for capacitor mounting, then device arrangement flexibility is improved, but cost and manufacturing difficulty increase
Solution Approach 1:
The patent merges the capacitor mounting function with the main substrate by integrating the capacitor into the existing multi-layer routing structure. The capacitor is positioned to utilize routing paths from the first routing layer, second routing layer, and third routing layer, eliminating the need for a separate capacitor substrate. This integration maintains device arrangement flexibility while significantly simplifying manufacturing processes and reducing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes parasitic inductance, reduces module size and cost, enhances power density, and improves reliability by eliminating multiple reflow soldering, leading to lower switching losses and increased efficiency.
Implementation Method 1
a first current path and a second current path are formed in the second routing area, respectively, on both sides of the capacitor, being parallel to each other and having a same current direction
Implementation Method 2
a third current path is formed between the electronic device, the capacitor and the vertical type power device, and the third current path is parallel to the first current path and the second current path with an opposite current direction
Data Source
AI summary
The disclosure relates to a power conversion module, including: a substrate including a routing layer and an insulating layer, the routing layer including a first routing area and a second routing area; an electronic device provided on the first routing area and electrically connected to the first routing area and the second routing area, respectively; a vertical type power device provided on the second routing area and electrically connected to the second routing area; and a capacitor provided on the substrate, disposed between the electronic device and the vertical type power device, and electrically connected to the electronic device and the vertical type power device, respectively. The power conversion module is provided with all devices on the same substrate, thus cost is reduced, yield rate and reliability are improved, and parasitic inductance inside the power conversion module can be reduced.