Voltage-source converter full bridge module IGBT configuration
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Solution Overview
Problem
Full bridge modules in voltage-source converters face challenges with compactness and bus bar sizing, resulting in a large lateral surface area and inefficient heat evacuation.
Innovation Solution
The configuration of switches on two parallel surfaces reduces the lateral surface area to that of two switches, allowing for smaller bus bars and a two-layer bus bar configuration, enhancing heat dissipation and safety by arranging IGBTs on separate heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all IGBTs are arranged on a single lateral surface, then the module structure is simple, but the lateral surface area becomes excessively large (at least four times the surface of one switch)
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of all IGBTs on a single lateral surface to a three-dimensional configuration where IGBTs are distributed across two parallel surfaces. This dimensional change allows the module to maintain structural simplicity while reducing the lateral surface area footprint by utilizing the vertical dimension for heat sink arrangement.
2Reliability
If bus bars cover the entire lateral surface of the module, then all IGBT connections are achieved, but the bus bar size and material usage increase significantly
Solution Approach 1:
By distributing IGBTs on two parallel surfaces, the bus bar routing is optimized to connect corresponding IGBTs on opposite surfaces directly, reducing the lateral coverage area. This dimensional arrangement allows bus bars to be more compact and use less material while maintaining all necessary electrical connections.
3Reliability
If IGBTs are arranged on a large lateral surface, then all connections can be made, but heat evacuation efficiency decreases
Solution Approach 1:
The patent arranges heat sinks on two parallel surfaces with IGBTs distributed accordingly, creating a dual-sided heat dissipation architecture. This dimensional configuration increases the effective heat evacuation surface area and improves thermal management efficiency by distributing heat sources and sinks across multiple spatial planes, thereby enhancing overall heat transfer capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size of the module, improves heat evacuation, and increases safety by containing potential IGBT explosions, while optimizing bus bar dimensions and reducing Joule heating.
Implementation Method 1
the first and the third IGBT 120, 140 are fixed in thermal connection on a first heat sink whereas the second and fourth IGBT are fixed in thermal connection on a second heat sink
Data Source
AI summary
The invention relates to a full Bridge module, for connecting an electrical device such as a DC capacitor to an electrical circuit. The full bridge module comprises: a first and a second terminal to connect to the electrical circuit; a third and a fourth terminal to connect to the electrical device. The full bridge module further comprises a first to a fourth switch that connect the first and the second terminal to the third and fourth terminal. The first and the second switches are arranged on a first surface, the third and the fourth switches being arranged on a second surface that is parallel to the first surface. The invention relates also to a Voltage-source converter.