SiC Inverter With Flow-Through Bus and Cold-Plate Cooling
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Solution Overview
Problem
Traditional power inverters face limitations in high power applications due to size constraints, current power output, and temperature requirements, which hinder their ability to efficiently convert DC to AC and vice versa, especially in high-temperature environments.
Innovation Solution
A compact, high-temperature capable power inverter utilizing silicon carbide (SiC) half-bridge rectifiers and a flow-through bus design with liquid-cooled cold-plate cooling, minimizing heat generation and electrical impedance, allowing for efficient bi-directional power conversion with low power loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional power inverter design is used, then device complexity is reduced, but power density and temperature capability are limited
Solution Approach 1:
The patent changes the material parameter from traditional silicon-based semiconductors to silicon carbide (SiC), enabling operation at elevated temperatures (up to 175°C or higher) and higher power densities (27 kW/L at power stage). This material parameter change resolves the contradiction by allowing higher power output without proportionally increasing device complexity, as SiC components inherently handle heat better and enable more compact thermal management designs.
Solution Approach 2:
The patent employs composite material structures including SiC half-bridge modules integrated with copper-based heat spreaders and thermal interface materials. This composite approach enables efficient heat dissipation in compact volumes, achieving high power density (16 kW/L overall) while managing thermal loads without requiring complex external cooling systems.
2Volume of moving object
If compact form factor is implemented, then volume is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent merges the power electronic components (SiC half-bridge modules) directly with the thermal management system through integrated copper heat spreaders and cold-plate cooling units. This consolidation eliminates the need for separate cooling assemblies, reducing overall inverter volume while maintaining effective heat dissipation. The merging of functional elements allows compact design without sacrificing temperature management capability.
Solution Approach 2:
The patent implements liquid cooling through cold-plate units that circulate coolant to remove heat from SiC components. This hydraulic thermal management approach enables efficient heat dissipation in compact volumes by using fluid convection to transfer heat away from high-power components, resolving the contradiction between small size and effective cooling.
3Loss of energy
If flow-through bus design is used, then power loss is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the DC bus into modular flow-through sections with standardized connectors and mounting interfaces. This segmentation allows the bus to be assembled from discrete components using conventional manufacturing techniques, reducing the impact of the complex flow-through design on manufacturability. The modular approach maintains low power loss through optimized current paths while enabling assembly through standard processes.
4Temperature
If silicon carbide components are used, then temperature capability is improved, but component cost increases
Solution Approach 1:
The patent uses SiC half-bridge modules that serve multiple functions: power switching, heat generation (for thermal management testing), and integrated sensing capabilities. This multi-functionality reduces the total component count and system complexity, partially offsetting the higher cost of SiC components. The universal application of SiC across all power switching positions maximizes the temperature capability benefit while minimizing the cost impact through standardized component usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high power density operation up to 200 kW in a compact form factor, with power densities of 27 kW/L at the power stage and 16 kW/L overall, capable of operating at elevated temperatures, suitable for advanced vehicle systems and hybrid-electric applications.
Implementation Method 1
a liquid cooled cold-plate cooling unit positioned between the upper DC bus and the lower DC bus
Implementation Method 2
liquid cooled cold-plate cooling unit
Implementation Method 3
silicon-carbide components that is compact in physical dimensions for high power, elevated temperature applications
Data Source
AI summary
One example is an inverter assembly for converting direct current (DC) to alternating current (AC). A DC connector on the inverter assembly is connected to an upper DC bus. A silicon carbide (SiC) heat sink is mounted above the upper DC bus and at least one capacitor is mounted above the SiC heat sink. A lower DC bus is connected to the upper DC bus and a liquid cooled cold-plate cooling unit is positioned between the upper and lower DC busses. SiC half-bridge units are located between the upper DC bus and the cold-plate and between the lower DC bus and the cold-plate. A gate driver unit is located on the upper DC bus above one converter heatsink and another driver located on the lower DC bus below the other converter heatsink. An AC output connector connects the converters to the AC output connecter.