Electrical Connecting Apparatus Guide Mechanism for Accurate IC Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electrical connecting apparatuses for semiconductor devices face issues with accurate contact due to displacement caused by vibration or dimensional inaccuracies, leading to ineffective testing.
Innovation Solution
The apparatus features a plate-shaped lower base with contactors, a first guide for precise positioning, and movable upper and second guides that ensure the device under test remains aligned with the contactors, preventing displacement during movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the IC holder moves up and down against the contactor holder to position the IC, then the lead electrodes are thrust to the contactors, but the IC may be displaced against the receptacle due to vibration or angular rotation, causing inaccurate contact
Solution Approach 1:
The guiding function is divided into two independent parts: the lower guide in the contactor holder that provides a stable positioning reference, and the upper guides in the IC holder that move independently. This segmentation allows the lower guide to maintain fixed positioning while the upper guides accommodate movement and vibration without affecting contact accuracy.
Solution Approach 2:
The lower guide pre-positions the IC and lead electrodes in the correct location before the upper guides engage. This preliminary positioning ensures that even when the IC holder moves up and down, the IC starts from an accurately positioned state, compensating for subsequent vibrations or angular rotations.
2Manufacturing precision
If the lower guides position the IC to both the receptacle and contactors, then positioning is achieved, but dimensional tolerance variations among ICs cause some ICs to be displaced against the contactors
Solution Approach 1:
The lower guide provides a localized, highly precise positioning reference at the contactor interface, while the upper guides provide a separate guiding function. This local quality enhancement at the critical contact interface ensures accurate positioning even when IC dimensional variations exist, as the lower guide compensates for these variations.
Solution Approach 2:
The lower guide acts as an intermediary between the IC and the contactors, absorbing dimensional variations and positioning tolerances. By introducing this intermediate positioning element, the system achieves consistent contact accuracy despite variations in IC manufacturing dimensions.
3Stability of the object's composition
If the upper guides are swung along the arc-shaped lower guiding surface, then the IC is guided accurately, but vibration from IC holder movement causes the IC to displace against the receptacle
Solution Approach 1:
The guiding system is segmented into the stationary lower guide and the movable upper guides. This segmentation isolates the stable arc-shaped lower guiding surface from vibration effects, while the upper guides can move independently to accommodate vibrations without transmitting them to the positioning reference.
Solution Approach 2:
The lower guide provides a counterbalancing stable reference that offsets the harmful effects of vibration. By having a fixed, stable lower guiding surface that does not move with the IC holder, the system creates a counteracting force against vibration-induced displacement.
Data Source
AI summary
In an electrical connecting apparatus, a first guide is arranged in a plate-shaped lower base in which the contactors are arranged. The first guide has a first space for guiding a device under test so that its electrodes will contact the tips of contactors and for positioning the device under test against the contactors. The device under test is guided to the first space by second guides and is received and thrust by the tips of the contactors. By doing so, displacement of the device under test caused by displacement of the upper base or the second guides is prevented.