Electrical Structural Member Upright PCB Connection
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Solution Overview
Problem
Existing electrical structural members with semiconductor packages face challenges in connecting to a printed circuit board in an upright state due to their cuboid shape, where the short sides abut the board, making stable attachment difficult.
Innovation Solution
The design incorporates two semiconductor packages with standardized surface-mountable structural forms, where the encapsulation materials of both packages are securely connected, allowing for adhesive bonding or alternative joining methods like friction welding, and featuring connectors along the edges for stable soldering to a printed circuit board, preventing tilting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrical structural members are constructed in a substantially cuboid manner with height smaller than width, then manufacturing and packaging become easier, but connection to printed circuit board in upright state becomes problematic
Solution Approach 1:
The patent applies asymmetry by changing the geometric configuration from a standard cuboid with height < width to an asymmetric arrangement where packages are positioned on opposite sides of a carrier board, creating an elongated structure. This asymmetric layout enables upright mounting on printed circuit boards while maintaining manufacturing simplicity through standardized package components.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional configuration by positioning semiconductor packages on opposite sides of a carrier board and enabling upright mounting. This dimensional change allows the structure to connect to printed circuit boards in an upright state, solving the connection problem while preserving ease of manufacture.
2Reliability
If encapsulation material encapsulates the entire connection frame, then protection is improved, but connection stability in upright state deteriorates
Solution Approach 1:
The patent applies segmentation by dividing the encapsulation into two distinct types: first encapsulation material that fully encapsulates the chip and connection frame for protection, and second encapsulation material that only partially encapsulates the connection frame to expose connection surfaces. This segmentation enables both protection and stable connection in upright configuration.
Solution Approach 2:
The patent implements local quality by applying different encapsulation characteristics to different regions of the connection frame. The first encapsulation material provides full coverage for protection, while the second encapsulation material provides partial coverage specifically at areas requiring stable connection, creating localized functional zones with optimized properties.
3Manufacturing precision
If standardized surface-mountable structural forms are used, then manufacturing precision is improved, but adaptability to different mounting configurations deteriorates
Solution Approach 1:
The patent applies universality by using standardized surface-mountable structural forms for the semiconductor packages while creating a multi-functional carrier board structure that accommodates various mounting configurations. The standardized packages ensure manufacturing precision, while the flexible carrier board design with opposite-side positioning enables adaptability to different mounting orientations and printed circuit board configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables stable and secure upright connection of the electrical structural member to a printed circuit board, preventing tilting and ensuring reliable attachment through robust solder connections and precise positioning using magnetic-field-sensitive sensors for enhanced accuracy.
Implementation Method 1
The first encapsulation material is securely connected to the second encapsulation material
Implementation Method 2
precise positioning using magnetic-field-sensitive sensors for enhanced accuracy
Implementation Method 3
featuring connectors along the edges for stable soldering to a printed circuit board
Data Source
AI summary
An electrical structural member comprises a first package and a second package. The first package has a first connection frame, a chip disposed in the first connection frame, and a first encapsulation material encapsulating the chip and at least portions of the first connection frame. The second package has a second connection frame and a second encapsulation material encapsulating at least portions of the second connection frame. The first encapsulation material is securely connected to the second encapsulation material.