Electroconductive Element Wavy Surface Topography
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Solution Overview
Problem
Current circuit pattern forming methods, such as photolithography and screen printing, face challenges in achieving high throughput and accuracy due to complex operations and equipment costs, with a need for a more efficient method to form electroconductive layers on substrates for various devices.
Innovation Solution
The development of an electroconductive element with a substrate featuring a first and second wavy surface, where the electroconductive layer is formed on the first wavy surface, and the relationship between the mean amplitudes and wavelengths of these surfaces is optimized to enhance throughput, with the electroconductive layer being continuously formed on a flat surface and discontinuously on a wavy surface, using materials like indium tin oxide or zinc oxide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used to form circuit patterns, then manufacturing precision is improved, but productivity deteriorates due to low throughput
Solution Approach 1:
The patent replaces the mechanical photolithography process with a direct writing method using a sharp tool to physically scratch or ablate the resist layer and underlying metal layer, forming circuit patterns through mechanical action rather than optical exposure and chemical development
Solution Approach 2:
The patent extracts and eliminates multiple intermediate steps from the traditional photolithography process, including mask alignment, optical exposure, and chemical development, by using a single-step direct writing approach that combines pattern formation and material removal in one operation
2Productivity
If screen printing is used to form electroconductive layers, then productivity is improved through high throughput, but device complexity increases due to mask alignment requirements
Solution Approach 1:
The patent extracts and eliminates the mask component entirely from the process, using direct mechanical writing to define circuit patterns without requiring any masking layers, alignment marks, or photomasks
Solution Approach 2:
The patent uses the substrate surface topography itself as a template or copy of the desired circuit pattern, where pre-formed凸起 (protrusions) and凹陷 (depressions) guide the direct writing tool to automatically trace and reproduce the circuit layout without external masks
3Productivity
If screen printing is used to form electroconductive layers, then productivity is improved, but manufacturing precision deteriorates due to hole clogging in masks
Solution Approach 1:
The patent extracts and eliminates the mask component that suffers from hole clogging, replacing it with a maskless direct writing approach where the circuit pattern is directly defined by the tool path and substrate topography
Solution Approach 2:
The patent replaces the screen printing mechanical system with a direct mechanical writing system that uses a sharp tool to physically define circuit patterns through controlled scratching or ablation, eliminating reliance on mask openings
Data Source
AI summary
An electroconductive element includes a substrate having a first wavy surface and a second wavy surface, and an electroconductive layer formed on the first wavy surface, wherein the electroconductive layer forms an electroconductive pattern, and the first wavy surface and the second wavy surface satisfy the following relationship: 0≦(Am1/λm1)<(Am2/λm2)≦1.8. Am1 is a mean amplitude of vibrations of the first wavy surface, Am2 is a mean amplitude of vibrations of the second wavy surface, λm1 is a mean wavelength of the first wavy surface, and λm2 is a mean wavelength of the second wavy surface.