Transparent Dielectrics TRIZ Cases

A spacer aligned with exposed conductive patterns distributes pressure during thermoforming and lamination to prevent breakage and preserve connections.

Non-ablative laser pulses pattern conductive layers into low-visibility non-conductive features while preserving protective films and cutting process steps.

A dry HMO sintering layer turns silver nanoparticles into conductive electrodes while avoiding solvent damage to underlying solar-cell layers.

Metal nanowire conductors and transparent resin interlayers keep touch panels low-resistance, transparent, and reliable under bending.

A transparent PCB cover structure contains liquid TIM while allowing fill monitoring, improving heat dissipation and product stability.

Obtuse-angle bent wire intersections reduce ink bleeding, etching gaps, and mesh visibility in transparent touch sensor conductive sheets.

A narrow mount section and wider extending section enlarge the light control region while preserving wiring space and mounting stability.

Segmented reflective portions in the circuit board minimize dark areas caused by manufacturing errors, improving light uniformity.

A one-glass-solution touch screen substrate bridge structure uses a single insulating layer between transparent electrodes to maintain electrical connectivity.

Exposed alignment mark with 30 μm insulating layer resolves trade-off between insulation reliability and optical visibility for precise component mounting.

An extended insulating layer covers conductive connecting pieces in a touch substrate, preventing oxidation and reducing structural complexity.

A laser-melted contact layer joins conductive balls to pattern lines in display devices.

A multi-layer micro-wire structure fills substrate channels with conductive materials to maintain electrical paths under mechanical strain.

Pulsed laser beams modify conductivity in transparent conductive films without ablating the material layer.

Direct laser irradiation patterns graphene holes to prevent substrate damage and reduce surface resistance without photoresist.

Coiled main flexible printed circuits with polyimide insulation resolve heat resistance issues while enabling fine pitch signal lines in rotary connectors.

Wider metal traces in touch sensor panel borders use higher resistivity materials to improve reliability and noise immunity while lowering manufacturing costs.

Segmented micro-wire electrodes resolve conductivity-transparency trade-offs in capacitive touch screens.

Selective encapsulation protects circuit board regions while leaving openings for secondary assembly and component operation.

A spacer layer prevents gel spread from widening the frame width, enabling precise terminal exposure and narrower touchscreen dimensions.

Segmented wiring patterns prevent insulating ink coverage on contact regions, resolving electrical conduction reliability issues in printed electronics.

Electrically conductive laserable paint applies directly to substrates to form integrated touch control surfaces.

Pre-forming pad structures on a buffering layer before applying the shading layer prevents black matrix charring and short circuits during processing.

Laminating dry photoresist to a substrate enables high-density metal interconnect formation on flexible plastic films.

A rigid panel integrates a conductive layer with insulating strips to form separate voltage conductors at the edge.

Offset printing via a rotating blanket roll merges sensing, insulating, and conductive layers into one step, reducing photolithography complexity.

A resin composition combines polyrotaxane with epoxy to enable elastic deformation.

Vacuum drying removes solvent from inkjet-printed paths while a protective layer prevents edge loss, minimizing sheet resistance.

Segmented micro-wires lower electrical resistance while minimizing bus area and material usage in touch screens.

A polyimide base film with a copper particle bond layer reduces external light transmittance to suppress back-surface reflections.

Cross-connected micro-wire arrays reduce electrical resistance and material usage in transparent electrodes.

A stabilizing metal plate supports a thin printed circuit board in an optoelectronic sensor, resolving mechanical stability issues while reducing height.

Layered patterned electrodes distribute conductivity across multiple transparent films, reducing visible patterns and improving visual uniformity.

A two-shot molding process encapsulates circuit board components with controlled pressure and heat distribution.

A substrate with optimized wavy surfaces guides electroconductive layer deposition to enhance surface resistance and antireflection characteristics.

Angled micro-wires in an anisotropic electrode increase conductivity by 50% while reducing transparency loss.

Transferring a metallic mesh to a transparent film balances low surface resistance with high optical transparency for antenna performance.

Modules employ transparent alignment marks on conductive film panels to resolve visibility issues with opaque metal features.

An additive electrodeposition process forms precise metal grids on flexible substrates, eliminating waste from subtractive etching.

A transparent conductor embeds metal nanowires in a bi-functional monomer matrix to achieve high transmittance and low sheet resistance.

A UV-blocking layer on a transparent substrate prevents cross-exposure during simultaneous two-sided photoresist patterning, reducing alignment complexity.

Substrate grooves house insulating layers to prevent conductive bridge breakage caused by climbing protuberant heights.