Digitally Encoded Laser Scanning for Low-Visibility Fine Feature Marking
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Solution Overview
Problem
Current methods for touch sensor patterning and printed electronics, such as photolithography and laser processing, are inefficient due to multiple processing steps, high costs, and the use of toxic materials, failing to provide efficient and cost-effective solutions for processing these devices.
Innovation Solution
A non-ablative laser processing method that changes the conductivity of a substrate's surface by generating laser pulses with specific parameters, allowing for the conversion of conductive layers into non-conductive features without material removal, using flexible polyethylene terephthalate substrates and silver nanowires, and maintaining the protective film intact during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser processing techniques are used to pattern conductive layers, then material can be removed to create features, but the processed areas have high visibility and require additional processing steps
Solution Approach 1:
The patent changes the laser processing parameters from ablative to non-ablative regime. By controlling laser pulse duration (picosecond to femtosecond range) and fluence (energy density) to remain below the ablation threshold, the material is modified in place rather than removed. This creates conductive or non-conductive features without visible surface damage, eliminating the need for additional processing steps to mask or fill processed areas.
Solution Approach 2:
The patent utilizes phase transitions of material under laser irradiation. By delivering ultra-short laser pulses with controlled fluence, the material undergoes phase changes (such as melting, vaporization, or structural transformation) that alter its electrical conductivity without removing the material. This allows the same laser system to create both conductive traces and non-conductive barriers through parameter adjustment alone.
2Manufacturing precision
If photolithography and screen printing are used for touch sensor patterning, then conductive patterns can be formed, but multiple processing steps and toxic materials are required
Solution Approach 1:
The patent replaces the multi-step mechanical and chemical process chain (screen printing, photolithography, etching, cleaning) with a single laser-based process. The laser system directly patterns the conductive ink layer by selectively altering its electrical properties through controlled irradiation, eliminating the need for masks, chemicals, and multiple sequential operations while maintaining pattern formation accuracy.
Solution Approach 2:
The laser processing system performs multiple functions that previously required separate process steps. A single laser pass can create conductive features, non-conductive barriers, and define pattern boundaries simultaneously by adjusting laser parameters (pulse duration, fluence, scan speed) in real-time, replacing the entire photolithography workflow with one versatile processing step.
3Manufacturing precision
If ablative laser processing is used to create features, then material removal achieves precise patterning, but the protective film is damaged and cycle time increases
Solution Approach 1:
The patent applies partial action by delivering laser energy just sufficient to alter the electrical properties of the conductive ink without reaching the threshold for material ablation or protective film damage. By operating in the non-ablative regime with controlled fluence, the process achieves precise patterning in a single pass, eliminating the need for subsequent protective film repair or replacement steps that would extend cycle time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and cost-effective processing of touch sensors and printed electronics by achieving ultra-low visibility of processed areas, reducing cycle time and material costs, while maintaining the structural integrity of the substrate and associated layers.
Implementation Method 1
laser parameters selected for non-ablatively changing a conductive layer disposed on the transparent substrate into a non-conductive feature
Implementation Method 2
the conductive layer becomes non-conductive in the processed area through a selective oxidation mechanism
Data Source
AI summary
Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.