Wiring Circuit Board Alignment Mark Visibility
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Solution Overview
Problem
Existing wiring circuit boards face challenges in achieving excellent visibility of alignment marks in both transmission and reflection modes due to the coverage of the transparent layer, which hinders the visibility of the alignment mark.
Innovation Solution
The wiring circuit board design includes an alignment mark exposed on one side with a peripheral portion of only the insulating layer, having a thickness of 30 μm or less, allowing increased reflective light in reflection mode and enhanced transmittance in transmission mode, along with a through hole structure for improved visibility and alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the alignment mark is covered with a transparent layer, then the insulating property is improved, but the visibility of the alignment mark in reflection mode deteriorates
Solution Approach 1:
The patent divides the insulating layer into two distinct regions: a first insulating layer covering the terminal and wire, and a second insulating layer with a hole covering the alignment mark. This segmentation allows different portions of the insulating layer to have different functions - one providing insulation and the other providing visibility for alignment.
Solution Approach 2:
The patent applies different properties to different parts of the insulating layer. The first insulating layer maintains full coverage for electrical insulation, while the second insulating layer has a hole created at the alignment mark position to allow light transmission and reflection, thus providing local visibility enhancement where needed.
2Illumination intensity
If the transparent layer is made thinner to improve visibility in transmission mode, then the transmittance is improved, but the insulating property deteriorates
Solution Approach 1:
The patent segments the insulating layer into two separate layers with different thicknesses and functions. The first insulating layer provides adequate insulation thickness, while the second insulating layer is thinner and contains a hole to enhance transmission mode visibility without compromising overall insulation performance.
Solution Approach 2:
The patent creates a localized thin region with a hole in the second insulating layer at the alignment mark position. This local modification allows light to pass through more easily in transmission mode while the rest of the insulating layer maintains sufficient thickness for electrical insulation.
3Reliability
If the alignment mark is fully covered with insulating layer, then the insulating property is improved, but the alignment accuracy deteriorates
Solution Approach 1:
The patent divides the insulating layer into two parts, with the second insulating layer having a hole that exposes the alignment mark. This segmentation ensures that the alignment mark remains visible and accessible for accurate alignment operations while the surrounding areas maintain proper insulation coverage.
Solution Approach 2:
The patent extracts or removes the insulating material from the specific region where the alignment mark is located by creating a hole in the second insulating layer. This extraction allows the alignment mark to be accessible for visualization and alignment purposes while the rest of the structure maintains insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides excellent visibility of the alignment mark in both reflection and transmission modes, enhancing the alignment accuracy and position precision of mounting components with respect to terminals.
Implementation Method 1
in a reflection mode in which light is applied from one side in the thickness direction of the alignment mark to the one-side surface in the thickness direction to detect reflective light produced on the one-side surface in the thickness direction of the alignment mark
Implementation Method 2
in a transmission mode in which light is applied to the peripheral portion to detect the light transmitting through the peripheral portion
Data Source
AI summary
A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 μm or less.