Embedded Cooling Channels in Electrodes for Thermal Distortion Control
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Solution Overview
Problem
The uneven heating of electrodes in ion source systems due to ion beam impact leads to thermal distortion, which becomes exacerbated with increasing electrode length, causing irregularities in the ion beam current and potential operational issues.
Innovation Solution
An apparatus with an embedded cooling channel in the electrodes, connected to a fluid source, such as a chiller or heater, and a controller to maintain a predetermined temperature, utilizing additive manufacturing techniques to ensure thermal conductivity and minimize distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrode length is increased to handle higher ion beam currents, then ion beam processing capability is improved, but thermal distortion increases due to uneven heating
Solution Approach 1:
The electrode is segmented thermally through the integration of multiple cooling channels that divide the thermal management system into distinct zones. This allows different regions of the electrode to be cooled independently, maintaining structural stability while handling higher ion beam currents.
Solution Approach 2:
A cooling fluid acts as an intermediary substance that absorbs heat from the electrode through the cooling channels. This mediator transfers thermal energy away from the electrode, preventing thermal distortion while allowing the electrode to maintain its structural integrity for higher current handling.
2Stability of the object's composition
If cooling channels are added to the electrode, then thermal distortion is reduced, but device complexity increases
Solution Approach 1:
The cooling channels are merged directly into the electrode structure itself, eliminating the need for separate cooling systems. This integration reduces device complexity by combining thermal management functionality with the electrode's structural components.
Solution Approach 2:
The electrode serves multiple functions: it provides the electrical field for ion beam extraction and simultaneously acts as a heat sink through its integrated cooling channels. This multi-functionality reduces the need for additional components, simplifying the overall device structure.
3Loss of substance
If electrode temperature is increased to reduce deposition, then deposition rate is reduced, but thermal distortion increases
Solution Approach 1:
The cooling system allows precise control of electrode temperature by adjusting cooling fluid flow rate and temperature. This parameter control enables optimization of the temperature to minimize deposition while maintaining thermal stability and preventing distortion.
Solution Approach 2:
The cooling system provides thermal feedback control where the temperature of the electrode can be monitored and adjusted by modifying the cooling fluid parameters. This feedback mechanism maintains optimal temperature to reduce deposition while preventing thermal distortion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus maintains uniform electrode temperatures, reducing thermal distortion and deposition rates, allowing for more stable and efficient ion beam processing by controlling the flow and temperature of the fluid through the cooling channels.
Implementation Method 1
By circulating fluid through the cooling channel, a more uniform temperature may be maintained, limiting thermal distortion
Implementation Method 2
the embedded cooling channel is lined with a thermally conductive material
Data Source
AI summary
An apparatus for limiting the deposition and thermal distortion of an electrode is disclosed. The apparatus includes a fluid source in communication with a cooling channel that is embedded in the electrode. By circulating fluid through the cooling channel, a more uniform temperature may be maintained, limiting thermal distortion. Further, the cooler temperature of the electrode may also limit the rate of deposition. The cooling channel may be embedded using an additive manufacturing process.


