Electronic Component Electrode Structure for Uniform Laser Via Holes
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Solution Overview
Problem
Existing electronic component incorporated substrates face challenges in forming uniform via holes due to variations in laser output, surface roughness, and electrode density, leading to potential defects in plating growth and connections.
Innovation Solution
Incorporating a first and second external electrode with inner metal layers having lower laser absorption rates than their outer counterparts, ensuring uniform depth of via holes by stabilizing laser machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser irradiation is used to form via holes in external electrodes, then via holes can be formed efficiently, but non-uniformity in via hole depths occurs due to variations in laser output, surface roughness, and electrode density
Solution Approach 1:
The external electrode is designed with non-uniform thickness distribution, where the thickness varies in the laser irradiation direction. This local variation in thickness compensates for the non-uniform laser energy distribution and other processing variations, ensuring that the laser penetrates to a uniform depth across all via holes regardless of their position on the electrode surface.
Solution Approach 2:
The invention changes the physical parameter of the external electrode (thickness) to achieve the desired outcome. By intentionally creating thickness variations in the electrode structure, the process transforms the problem of non-uniform laser penetration into a solution where the varying thickness compensates for processing non-uniformities, resulting in uniform via hole depths.
2Reliability
If via holes are formed by laser irradiation, then connections can be established, but plating growth becomes insufficient in deep via holes leading to defective connections
Solution Approach 1:
By creating local variations in electrode thickness, the invention ensures that the laser penetration depth becomes uniform across different via holes. This uniformity prevents excessively deep via holes that would require excessive plating thickness, thereby ensuring sufficient and uniform plating growth in all via holes for reliable connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces variations in via hole depths, enhancing the reliability of connections between via conductors and external electrodes, thereby improving the manufacturing process.
Implementation Method 1
a via hole for exposing the external electrode is formed by irradiating the insulating layer in which the electronic component is embedded with a laser
Implementation Method 2
a via conductor is formed by applying plating treatment to the via hole
Data Source
AI summary
Provided is an electronic component including a base body, a first internal element, a first external electrode, and a second external electrode. The first external electrode has a first outer metal layer and a first inner metal layer that is provided between the first outer metal layer and the first internal element, the second external electrode has a second outer metal layer and a second inner metal layer that is provided between the second outer metal layer and the first internal element, and the first inner metal layer has a lower laser absorption rate than any of the first outer metal layer and the second outer metal layer, and the second inner metal layer has a lower laser absorption rate than any of the first outer metal layer and the second outer metal layer.