Upper Electrode Mounting with Gravity-Center Feedback Alignment

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Solution Overview

Problem

The manual mounting of upper electrodes in semiconductor devices leads to uneven temperature and ionization distribution, affecting the stability and yield of semiconductor manufacturing processes.

Innovation Solution

A mounting apparatus with a tray having first and second bearing portions, a sensor to collect center of gravity offsets, and a driving assembly to automatically adjust the electrode positions, ensuring accurate and stable mounting of upper electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual mounting of upper electrodes is performed, then operation flexibility is maintained, but mounting precision and uniformity deteriorate

Engineering Contradiction:
Improveoperation flexibilityVSAvoidmounting precision
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent replaces manual mechanical mounting operations with an automated mounting apparatus that uses sensors to detect electrode positions and driving assemblies to automatically adjust and mount the upper electrodes, thereby improving mounting precision while maintaining operational flexibility through programmable control

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The mounting apparatus performs self-adjustment through sensors that automatically detect the positions of upper electrodes and trigger the driving assembly to make precise adjustments without human intervention, achieving consistent mounting precision across multiple operations

Inventive Principle:
Principle #25Self-service

2Device complexity

If manual mounting is used, then device complexity is reduced, but temperature field uniformity and process stability deteriorate

Engineering Contradiction:
Improvemounting system complexityVSAvoidtemperature field uniformity
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The patent replaces manual mounting with an automated system that precisely positions upper electrodes, ensuring uniform temperature fields and stable plasma generation during semiconductor processing, thereby improving process stability despite increased device complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The mounting apparatus incorporates sensors that detect electrode positions and provide feedback to the control system, which then adjusts the driving assembly to achieve precise positioning, ensuring uniform temperature distribution and process stability through closed-loop control

Inventive Principle:
Principle #23Feedback

3Manufacturing precision

If automated mounting apparatus is introduced, then mounting precision and process stability are improved, but device complexity increases

Engineering Contradiction:
Improveelectrode positioning precisionVSAvoidmounting apparatus complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The mounting apparatus is divided into functional modules including sensors for detection, driving assemblies for adjustment, and control units for coordination, allowing each component to be optimized independently while maintaining overall system precision

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mounting apparatus is designed with multi-functional components that can perform multiple operations (detection, adjustment, mounting) within a single integrated system, reducing the need for separate devices and minimizing overall system complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces human error, prolongs device lifespan, improves maintenance success rates, and stabilizes semiconductor processes, enhancing production yield and reducing personnel workload.

Implementation Method 1

the second bearing portion has a gravity center that coincides with a center of gravity of the first bearing portion; a first sensor, which is disposed at the center of gravity of the first bearing portion and collects the offsets of the center of gravity of the supported first upper electrode portion and the second upper electrode portion

Methodology Applied
Scientific EffectCenter of gravity: Gravitation

Data Source

PatentUS12125887B2Mounting apparatus and mounting method
Publication Date: 2024.10.22 CHANGXIN MEMORY TECH INC
  • US12125887B2 patent drawing
  • US12125887B2 patent drawing
  • US12125887B2 patent drawing

AI summary

The embodiment of the present application discloses a mounting apparatus and a mounting method. The mounting apparatus comprises: a bracket; a tray movably disposed on the bracket, wherein the tray comprises the first bearing portion and the second bearing portion, the second bearing portion is disposed around the circumference of the first bearing portion and coincides with the center of gravity of the first bearing portion, a first sensor, which is disposed at the center of gravity of the first bearing portion and collects the offset of the center of gravity of the supported first upper electrode portion and the second upper electrode portion; and a driving assembly, which is connected to the tray, drives the tray to ascend and descend and drives the tray to adjust the supporting positions of the first upper electrode portion and the second upper electrode portion.