Surface-Mount Electrode Protrusions for Solder Standoff Inspection
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Solution Overview
Problem
Conventional electronic components with flush mounting surfaces and external electrodes pose challenges in maintaining a solder standoff and accurately inspecting electrical characteristics due to increased contact resistance caused by oxide films.
Innovation Solution
The electronic component design includes protrusions on external electrodes to create a solder standoff and facilitate oxide film removal during inspection, with the protrusions being strategically positioned to allow for increased pressure from contact probes, ensuring accurate electrical characterization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the mounting surface of the base member and the external electrodes are made flush with each other, then the manufacturing process is simplified, but a gap (standoff) for filling solder cannot be maintained
Solution Approach 1:
The external electrode is divided into two distinct portions: a first electrode portion that is flush with the mounting surface, and a second electrode portion that protrudes from the mounting surface. This segmentation allows the electrode to serve dual functions - maintaining flush alignment for manufacturing simplicity while providing a protruding section to establish the solder standoff gap.
Solution Approach 2:
Different portions of the external electrode have different spatial relationships with the mounting surface. The first electrode portion is positioned flush with the mounting surface for manufacturing ease, while the second electrode portion protrudes locally to create the necessary solder standoff. This local quality variation resolves the contradiction between manufacturing simplicity and solder gap maintenance.
2Device complexity
If the mounting surface of the base member and the external electrodes are made flush with each other, then the structure is simplified, but it becomes difficult to remove the oxide film formed on the external electrodes during inspection
Solution Approach 1:
The external electrode is segmented into a first electrode portion flush with the mounting surface and a second electrode portion that protrudes. This segmentation enables the protruding second portion to be accessed by contact probes for inspection, allowing oxide film removal through mechanical action while the first portion remains integrated with the mounting surface.
Solution Approach 2:
The second electrode portion protrudes from the mounting surface in advance, positioning it to be accessible by contact probes before inspection occurs. This preliminary positioning facilitates the removal of oxide films formed on the external electrodes during inspection processes.
3Device complexity
If the mounting surface of the base member and the external electrodes are made flush with each other, then the component structure is simplified, but the contact resistance of the contact probe is increased
Solution Approach 1:
The external electrode is divided into a first electrode portion flush with the mounting surface and a second electrode portion that protrudes. The protruding second portion provides improved electrical contact with contact probes during inspection, reducing contact resistance while the overall component structure remains relatively simple.
Solution Approach 2:
The second electrode portion has a different spatial configuration (protruding) compared to the first electrode portion (flush). This local quality difference creates an optimal contact surface for probes, reducing contact resistance and improving measurement precision without significantly complicating the overall component structure.
Data Source
AI summary
One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.