Electrodeposited Metal Grid on Flexible Polymer
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Solution Overview
Problem
Existing methods for forming conductive grid patterns on flexible substrates for photovoltaic cells face challenges such as high interconnection costs, waste generation, and potential substrate adulteration, particularly in the use of Cu grid structures and subtractive etching processes.
Innovation Solution
An additive method involving a rotatable drum with a conductive surface coated with a patterned insulating layer is used, where a metal-containing solution is applied, and electrical current is used for electrodeposition to form a conductive grid on a transparent polymer sheet, minimizing waste and avoiding harmful chemical baths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If subtractive etching processes are used to form Cu grid structures, then conductive grid patterns can be formed on flexible substrates, but significant waste is generated and substrate adulteration occurs
Solution Approach 1:
The patent inverts the conventional subtractive approach by using an additive electrodeposition method. Instead of etching away material to create grid patterns, the invention deposits metal onto a patterned insulating coating on a conductive drum, thereby forming the grid structure through material addition rather than removal. This eliminates the waste associated with subtractive processes.
Solution Approach 2:
The patent extracts the harmful elements (chemical etchants, waste byproducts) from the grid formation process by replacing the subtractive etching method with an additive electrodeposition method. The grid pattern is formed by selectively depositing metal only where needed, rather than removing material from a continuous layer, thus eliminating substrate adulteration and chemical waste.
2Reliability
If conventional high-temperature processing is used for metal deposition, then adequate adhesion and conductivity are achieved, but the flexible polymer substrate may be damaged or require complex temperature control
Solution Approach 1:
The patent changes the processing parameters by using electrodeposition at lower temperatures compared to conventional high-temperature metal deposition methods. The electrochemical deposition process allows metal grids to be formed on flexible polymer substrates without subjecting them to damaging high temperatures, while still achieving adequate adhesion and conductivity through the electrochemical bonding mechanism.
3Loss of energy
If complex grid patterns are formed using traditional methods, then photovoltaic efficiency is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent replaces complex mechanical masking and etching systems with an electrochemical electrodeposition system. The grid patterns are formed by applying electrical current to a conductive drum with a patterned insulating coating, allowing complex geometries to be created through electrical control rather than mechanical manipulation, thereby reducing manufacturing complexity while achieving high PV efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in low waste generation, improved PV efficiency by reducing resistive and optical losses, and allows for complex grid patterns with high accuracy, enabling a clean, low-temperature, high-throughput process suitable for roll-to-roll production.
Implementation Method 1
applying electrical current to the conductive cylinder, thereby causing electrodeposition of metal onto the exposed portions of the conductive surface and forming a conductive metal grid on the cylinder
Data Source
AI summary
A conductive grid formation system, apparatus, and related methods may include a drum having a conductive surface, an insulation layer coating said surface, and a grid pattern formed in the insulation layer to expose portions of the conductive surface. The drum surface may be rotated into and out of a chemical bath, such that a metallic grid is electrodeposited in the exposed portions of the conductive surface. A polymer sheet may be laminated to the surface of the drum and then removed, such that the metallic grid attaches to the polymer sheet and is removed with the polymer sheet. Heat, pressure, and/or adhesive may be utilized in various steps of the process, to facilitate preferential adhesion of the metallic grid to the polymer sheet.