Electroformed Vertical Wiring for Compact Electronic Packages
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Solution Overview
Problem
Conventional methods for forming vertical and horizontal wiring in electronic device packages, such as DFP and WLCSP, are complex and costly, requiring specialized facilities and through-electrode techniques, which limits manufacturing capabilities and increases costs.
Innovation Solution
A wiring electronic component with vertically and horizontally integrated conductive pathways formed through electroforming or plating, using a conductive support portion and seed layers, allowing for the creation of a component that can be assembled offline with facilities similar to those used in the former stage of semiconductor manufacturing, eliminating the need for through-electrode techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-electrode techniques are used to form vertical wiring in semiconductor substrates, then connection reliability between substrate and external electrodes is improved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent divides the wiring structure into separate components: a substrate without through electrodes, a wiring board with vertical wiring, and connection structures (protrusions/recesses) that join them. This segmentation eliminates the need for complex through-electrode formation in the substrate while maintaining reliable electrical connections through the alternative vertical wiring approach on the wiring board.
Solution Approach 2:
The wiring board acts as an intermediary component between the substrate and external electrodes. It provides the vertical wiring function that would otherwise require through electrodes in the substrate, thereby simplifying substrate manufacturing while achieving the same connection reliability through this intermediate wiring board structure.
2Reliability
If conventional rewiring methods (plating and lithography) are used on wafer surfaces, then electrical connections are established, but manufacturing cost increases due to requirement of former-stage facilities
Solution Approach 1:
The patent separates the wiring formation process from substrate fabrication by using a distinct wiring board component. This allows rewiring to be performed on the wiring board using simpler, more cost-effective methods rather than requiring expensive former-stage facilities for direct wafer processing, while still achieving reliable electrical connections.
Solution Approach 2:
Instead of performing complex plating and lithography directly on the semiconductor wafer, the patent uses a wiring board that copies or replicates the necessary wiring functions. This wiring board can be manufactured using less expensive processes and then integrated with the substrate, reducing overall manufacturing costs while maintaining connection reliability.
3Adaptability or versatility
If double-sided electrode structures with through electrodes are implemented, then package functionality is achieved, but package size reduction is limited due to process complexity
Solution Approach 1:
The patent achieves double-sided electrode functionality through segmentation: the substrate provides one set of electrodes, the wiring board provides vertical wiring and additional electrodes on its opposite face, and connection structures join them. This segmented approach achieves the required package functionality without the size penalties associated with traditional through-electrode methods.
Solution Approach 2:
The patent transitions from planar wiring to three-dimensional vertical wiring using the wiring board structure. By utilizing the vertical dimension with protrusions and recesses for connection, the design achieves compact packaging with double-sided electrode functionality while reducing overall package size compared to conventional approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enables the production of compact, high-density electronic device packages like cellular phones and sensor packages without the need for expensive facilities, allowing manufacturers to enter the market without large investments.
Implementation Method 1
a plurality of vertical wiring portions formed through electroforming such that they are integrally connected to the support portion
Implementation Method 2
a plurality of vertical wiring portions formed through plating such that they are integrally connected to the support portion
Data Source
Figure 1(A)~1(C)
Figure 2~3
Figure 4~6
AI summary
A wiring electronic component of the present invention is incorporated into an electronic device package in which a circuit element including a semiconductor chip is disposed and in which the circuit element is connected to a wiring pattern on the back face and also connected, via vertical wiring, to external electrodes located on the front face opposite the wiring pattern. The wiring electronic component is composed of an electrically conductive support portion, which serves as an electroforming mother die, and a plurality of vertical wiring portions formed through electroforming such that they are integrally connected to the support portion.