Electroless Deposition Filter and Oxygen Control System
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electroless deposition systems are prone to 'plating out,' a catastrophic deposition of metal on surfaces other than the substrate, leading to metal particle accumulation and instability in the deposition solution, which previous methods have been unable to effectively prevent.
Innovation Solution
A system and method that maintain an optimal dissolved oxygen concentration in the electroless deposition solution using sensors and controllers to inhibit metal particle growth and deposition, combined with agitators to ensure uniform oxygen distribution and filtration to remove particles, thereby preventing plating out.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electroless deposition solution is recycled, then productivity is improved, but plating out occurs due to metal particle accumulation
Solution Approach 1:
The patent extracts harmful metal particles from the recycled electroless deposition solution using a filter system, separating the useful solution from the harmful contaminants that cause plating out, thereby maintaining solution stability while enabling continuous recycling
Solution Approach 2:
The patent changes the dissolved oxygen concentration parameter in the electroless deposition solution by adding an oxygen source and using an oxygen sensor with controller to maintain optimal oxygen levels, which prevents metal particle growth and deposition on chamber walls
2Object-affected harmful factors
If dissolved oxygen concentration is increased, then metal particle growth is inhibited, but solution composition stability is affected
Solution Approach 1:
The patent employs an oxygen sensor and controller that form a feedback loop to monitor and adjust the dissolved oxygen concentration in the electroless deposition solution, maintaining it within an optimal range that prevents metal particle growth while preserving solution composition stability
Solution Approach 2:
The patent precisely controls the dissolved oxygen concentration parameter within an optimal range, changing it from uncontrolled to controlled levels that inhibit metal particle growth without disrupting the overall solution composition and chemistry
Data Source
AI summary
One or more aspects of this invention pertain to fabrication of electronic devices. One aspect of the present invention is a system for electroless deposition of metal on a substrate. According to one or more embodiments of the present invention, the system comprises a main subsystem in combination with one or more subsystems for electroless deposition on a substrate. Another aspect of the present invention is a method of making an electronic device. According to one or more embodiments of the present invention, the method comprises one or more processes. Descriptions according to one or more embodiments of the system and the processes are presented.