Electrolytic Electrode Movement for Uniform Conductive Pattern Thickness
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Solution Overview
Problem
Existing methods for increasing the thickness of electrically conductive patterns on dielectric substrates, such as those used in RFID labels and flexible electronic circuits, face challenges including irregular layer growth, limited thickness achievement, material wastage due to auxiliary tracks, and contamination of electrodes, which hinder large-scale industrial application.
Innovation Solution
A method and device involving an electrolytic bath with a negatively charged electrode that moves in contact with the pattern, allowing for homogeneous layer thickness distribution and simultaneous contact at multiple positions, eliminating the need for auxiliary tracks and reducing electrode contamination, by using a contacting movement and a fixed, endless path of movement for the electrode that extends partly above the bath.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a stationary electrode is used in the electrolytic bath, then the process is simple to operate, but the layer thickness distribution becomes irregular and electrode contamination occurs
Solution Approach 1:
The electrode is transformed from a stationary component to a moving component that travels along a predefined path above the electrolytic bath. This dynamic configuration allows the electrode to sequentially contact different positions of the conductive pattern, ensuring uniform layer thickness distribution while preventing contamination through continuous movement and periodic immersion.
2Device complexity
If the electrode remains stationary in the electrolytic bath, then the device structure is simple, but electrode contamination occurs and layer thickness is limited
Solution Approach 1:
The electrode system employs dynamic movement along a fixed endless path, transitioning between immersion in and withdrawal from the electrolytic bath. This dynamic operation prevents contamination by limiting electrode exposure to the bath only during necessary contact periods, while the fixed path structure maintains reasonable device complexity.
Solution Approach 2:
The electrode continuously moves along its predefined path, maintaining a consistent cycle of immersion and withdrawal. This continuous motion ensures that the electrode is only contaminated during brief contact periods with the pattern, while the majority of the time it remains above the bath, preventing accumulation of contaminants and enabling sustained reliable operation.
3Ease of manufacture
If auxiliary electrical tracks are used to enable electrolytic process, then the process can be completed, but raw material loss increases
Solution Approach 1:
The invention extracts and eliminates the auxiliary electrical tracks from the process by using a moving electrode that directly contacts only the intended conductive pattern areas. This removal of unnecessary components prevents material loss associated with auxiliary tracks and their deposited materials, while the direct contact method ensures the electrolytic process completes effectively.
4Device complexity
If the electrode contacts only one position of the pattern, then the process is simple to control, but layer thickness uniformity cannot be achieved
Solution Approach 1:
The electrode systematically moves along a fixed endless path that brings it into sequential contact with multiple positions of the conductive pattern. This dynamic multi-position contact approach ensures uniform layer thickness distribution across the entire pattern, while the predetermined path maintains manageable device complexity through automated motion control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables large-scale, industrially sound deposition of electrically conductive patterns with uniform thickness and minimal raw material usage, overcoming limitations of previous methods by ensuring consistent electrolytic growth and preventing electrode contamination.
Implementation Method 1
immersing the substrate with the pattern present thereon in an electrolytic bath, electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate
Implementation Method 2
electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate
Data Source
AI summary
The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps ofimmersing the substrate with the pattern present thereon in an electrolytic bath,electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, andeffecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate.The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.