Cells TRIZ Cases
- Oxygen Delivery Apparatus for Copper I Suppression in Electroplating
An oxygen-delivery apparatus maintains dissolved oxygen above 10 ppm to suppress copper (I) ion formation during electroplating.
- Sputtering Apparatus Magnet Unit Repulsive Force Mechanism
A sputtering apparatus magnet unit uses a repulsive force mechanism to counter magnetic attraction during target replacement.
- Laser-Assisted Synchronous Electroplating Filling for Differential Vias
Selective laser irradiation through a mask creates localized temperature differences that balance filling rates across varying via sizes, eliminating voids.