Thin Membrane Support for Compact Electroplating Processor
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Solution Overview
Problem
In compact electroplating processors with limited vertical space, conventional membrane supports are too large, leading to gas bubble nucleation and membrane sagging, which causes wafer defects and interferes with fluid flow due to inadequate support for the membrane.
Innovation Solution
A thin plastic membrane support, such as PEEK or Teflon fluorine resin, is used to hold the membrane in place, with a rigid cup providing upper support and a clamping mechanism to maintain the membrane's shape and position, minimizing height and electric field interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional membrane supports are used in compact processors, then the membrane is adequately supported, but the processor height increases and gas bubble nucleation occurs
Solution Approach 1:
The patent employs a thin film membrane support structure that provides adequate membrane stabilization while minimizing vertical dimension. The thin film design allows the membrane to be supported without requiring thick rigid structures, thus resolving the contradiction between membrane support stability and processor height.
Solution Approach 2:
The patent redistributes the membrane support function from a vertical dimension to a horizontal dimension by using a thin film structure that spans across the membrane. This dimensional shift allows the membrane to be supported effectively while maintaining a compact vertical profile, addressing both membrane stability and processor height constraints.
2Reliability
If conventional membrane supports are used in compact processors, then the membrane is adequately supported, but gas bubble nucleation and wafer defects increase
Solution Approach 1:
The thin film membrane support reduces the vertical space available for gas bubble nucleation and adhering to the membrane surface. By minimizing the support structure's thickness, the patent reduces the volume and surface area where gas bubbles can form, thereby decreasing wafer defects while maintaining membrane stability.
Solution Approach 2:
The patent extracts the membrane support function from a bulky three-dimensional structure and implements it through a thin two-dimensional film. This extraction of the support function into a minimal-volume form factor eliminates the harmful effect of gas bubble nucleation while preserving the essential membrane stabilization capability.
3Length of stationary object
If the membrane is not supported in compact processors, then processor height is minimized, but the membrane sags and wrinkles causing fluid flow interference
Solution Approach 1:
The thin film membrane support provides continuous stabilization across the membrane surface, preventing sagging and wrinkling while maintaining a compact processor height. The film's flexibility allows it to conform to the membrane and maintain its shape without requiring significant vertical space.
Solution Approach 2:
The patent transitions from vertical support structures to horizontal thin film supports, redistributing the membrane stabilization function across the horizontal plane. This dimensional redistribution maintains membrane shape stability while preserving minimal processor height.
4Length of stationary object
If the membrane is not supported in compact processors, then processor height is minimized, but wafer defects increase due to membrane interference
Solution Approach 1:
The thin film membrane support structure prevents membrane sagging and wrinkling that would otherwise interfere with the wafer surface. By maintaining membrane flatness through the thin film support, the patent reduces wafer defects while keeping the processor height minimized.
Solution Approach 2:
The patent extracts the membrane support function into a minimal thin film structure that prevents membrane interference with the wafer. This extraction eliminates the harmful effect of membrane-induced wafer defects while maintaining compact processor dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents membrane sagging and gas bubble trapping, enhancing electroplating performance by maintaining uniform fluid flow and reducing wafer defects in compact processor designs.
Implementation Method 1
The membrane allows certain ions to pass through, while blocking passage of other molecules
Implementation Method 2
one or more layers of metal or other conductive materials are formed on a wafer in an electroplating processor
Data Source
AI summary
An electroplating processor includes a thin lower membrane support for supporting a membrane. The lower membrane support may be provided as a flexible plastic sheet having a pattern of through-openings. The through-openings may be aligned with openings in a rigid upper membrane support. The perimeter of the lower membrane may be clamped in the same perimeter seal as used to clamp and seal the perimeter of the membrane. The lower membrane support supports the membrane without adding significantly to the overall height of the processor. The processor can be stacked in a two level processing system without requiring additional clean room space.