Silver Film Formation via Solid Electrolyte Deposition
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Solution Overview
Problem
Conventional solid electrolyte deposition methods often fail to form uniform silver films due to silver dendrite generation and hydrogen gas interference, leading to non-film formation portions on substrates.
Innovation Solution
A method involving a porous membrane without ion exchange functional groups, an electrolytic solution containing silver organic sulfonate and organic sulfonic acid ions, and a silver methanesulfonate-potassium iodide bath is used, where the silver film is formed on a crystalline metal substrate to suppress silver dendrite formation and hydrogen gas retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional solid electrolyte deposition is used to form silver film, then the waste liquid amount is reduced and environmental load is lowered, but silver dendrite is generated in the solid electrolyte membrane resulting in non-uniform film formation
Solution Approach 1:
The patent changes the chemical composition parameters of the electrolytic solution by using silver organic sulfonate instead of conventional electrolytes, and controls the ratio of organic sulfonic acid ions to silver ions within 5:95 to 45:55. This parameter change prevents silver dendrite formation while maintaining the environmental benefits of reduced waste liquid.
Solution Approach 2:
The patent uses a composite electrolytic solution system comprising silver organic sulfonate combined with organic sulfonic acid ions, creating a new composite electrolyte composition that prevents dendrite formation while maintaining low environmental impact.
2Device complexity
If conventional solid electrolyte deposition is used, then the process is simplified, but hydrogen gas is generated and retained between the separator and substrate causing non-film formation portions
Solution Approach 1:
The patent changes the electrolytic solution composition to silver organic sulfonate with controlled organic sulfonic acid ion concentration, which suppresses hydrogen gas generation during electrolysis. This maintains the simple solid electrolyte deposition process while eliminating film formation defects.
3Temperature
If silver paste is used for high temperature applications, then the melting point issue is resolved, but a separate silver plated buffer layer is required adding process steps
Solution Approach 1:
The patent merges the buffer layer function and the silver plating function into a single silver film deposition process. The silver film formed by the improved solid electrolyte deposition serves both as the thermal buffer layer and the functional silver layer, eliminating the need for separate layers and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the uniform formation of silver films with high current efficiency, eliminating non-film formation portions and enhancing the environmental sustainability of the process by reducing waste and environmental load.
Implementation Method 1
the anode is partially ionized by applying the voltage to the anode and the cathode
Implementation Method 2
the metal ions generated by the ionization of the anode pass through the solid electrolyte to be deposited on a substrate disposed in the cathode side
Implementation Method 3
reducing metal ions contained in the solid electrolyte membrane to form a metal film on a surface of the substrate
Implementation Method 4
the separator is a porous membrane without ion exchange functional group
Implementation Method 5
applying a voltage between the anode and the substrate to form a silver film on the substrate
Data Source
AI summary
It is an object of the present disclosure to provide a method that allows uniformly forming a silver film by a solid electrolyte deposition. One aspect of this embodiment is a method for forming a silver film. The method includes disposing an anode, a substrate as a cathode, and a separator such that the separator is positioned between the anode and the substrate and the separator is in contact with a surface of the substrate, the separator including an electrolytic solution that contains silver ions, and applying a voltage between the anode and the substrate to form a silver film on the substrate. The separator is a porous membrane without ion exchange functional group. The electrolytic solution contains organic sulfonic acid ions. The substrate contains a crystalline metal, and a silver film is formed on the crystalline metal.