Filling Plating System Additive Adhesion Region

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Solution Overview

Problem

Filling plating in via holes and through holes can be incomplete due to interruptions between electrolytic plating cells, leading to reduced filling performance and reliability, especially when the size and depth of holes vary and multiple cells are used for productivity and facility size considerations.

Innovation Solution

A filling plating system that includes a plurality of electrolytic plating cells with an additive adhesion region between each cell, where a solution containing a leveler, brightener, or carrier is directly adhered to the workpiece, ensuring consistent filling even when plating is interrupted between cells, using additives like nitrogen-containing organic compounds, sulfur-containing organic compounds, and polyether compounds.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If filling plating is performed by separating into some electrolytic plating cells, then productivity is improved and facility size is optimized, but filling performance deteriorates due to plating interruption between cells

Engineering Contradiction:

ImproveproductivityVSAvoidfilling performance

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The additive adhesion region applies additive solution to the workpiece surface before the workpiece enters the electrolytic plating cells. This preliminary action ensures that the workpiece surface is pre-coated with additives that maintain filling performance even when plating is interrupted between cells, solving the contradiction between productivity (multiple cells) and filling performance (interruption effects).

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The additive adhesion region acts as an intermediary between the workpiece and the electrolytic plating cells. By applying additive solution in this intermediate region, the system bridges the gap caused by interruptions between cells, maintaining continuous filling performance while allowing the plating process to be divided into multiple cells for improved productivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of stationary object

If plating is interrupted between electrolytic plating cells, then facility size and installation site requirements are optimized, but filling quality deteriorates

Engineering Contradiction:

Improvefacility sizeVSAvoidfilling quality

Core Design Contradiction:

Volume of stationary objectVSManufacturing precision

Solution Approach 1:

The additive solution is applied to the workpiece surface in advance, before the workpiece enters the series of electrolytic plating cells. This preliminary coating ensures that even when plating is interrupted between cells, the workpiece maintains its filling quality. This allows the facility to be divided into smaller, more manageable cells that can be installed in limited spaces without compromising filling quality.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If multiple electrolytic plating cells are used, then installation flexibility is improved, but filling performance becomes inconsistent

Engineering Contradiction:

Improveinstallation flexibilityVSAvoidfilling performance consistency

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The additive adhesion region applies additive solution specifically at the location where the workpiece surface needs enhancement before entering the plating cells. This localized application ensures that each workpiece receives the necessary additive coating regardless of which plating cell it passes through, maintaining consistent filling performance across multiple cells and enhancing installation flexibility.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach maintains high filling performance and reliability by inhibiting declines in filling quality, even with multiple interruptions, and is cost-effective by ensuring uniform additive composition and concentration across cells, applicable to both horizontal and vertical plating devices.

Implementation Method 1

solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound

Methodology Applied

Scientific EffectAdsorption: Adsorption

Implementation Method 2

solution containing one or more kinds of additive selected from at least a brightener comprising sulfur-containing organic compound

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Implementation Method 3

carrier comprising polyether compound, is directly adhered to the work to be plated

Methodology Applied

Scientific EffectAdsorption: Adsorption

Data Source

PatentUS11560640B2Filling plating system and filling plating method

Publication Date: 2023.01.24 C UYEMURA & CO LTD

AI summary

The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.