Substrate Holder Seal Gas Flow for Plating Solution Removal
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Solution Overview
Problem
The repeated use of a substrate holder in electroplating processes leads to the accumulation of plating solution on its seals, which can cause corrosion of electrical contacts, resulting in inconsistent contact resistance and non-uniform plating.
Innovation Solution
A method involving the formation of a gas flow through the gap between the seal and the substrate after separating the seal from the plated substrate, with the gas flowing from the inside to the outside of the substrate holder, to prevent liquid from entering the holder and contacting the electrical contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate holder is repeatedly used to plate multiple substrates, then productivity is improved, but plating solution accumulates on the seal and contacts electrical contacts causing corrosion and contact resistance changes
Solution Approach 1:
A gas flow is introduced through the substrate holder before plating begins to remove liquid from the seal in advance. This preliminary drying action prevents plating solution from accumulating on the seal during subsequent substrate processing, thereby maintaining reliable electrical contact resistance stability across multiple substrates without requiring frequent interruptions for cleaning
Solution Approach 2:
Gas flow is utilized to remove liquid from the seal between substrate processing cycles. The pneumatic action of gas flowing through the holder creates a drying effect that prevents plating solution accumulation on the seal, maintaining electrical contact reliability while enabling continuous high-productivity operation
2Reliability
If the seal contacts the substrate to prevent plating solution from contacting electrical contacts, then reliability is improved, but plating solution gradually moves into the holder interior and contacts electrical contacts
Solution Approach 1:
Gas flow is applied before plating operations to pre-dry the seal and establish a liquid-free interface. This preliminary action creates a barrier condition that prevents plating solution from migrating along the seal into the holder interior during the plating process, maintaining both contact protection and interior dryness
Solution Approach 2:
Gas flow acts as an intermediary medium between the seal and plating solution. By introducing gas through the holder, a gas phase barrier is created that prevents liquid plating solution from contacting and migrating along the seal interface, thereby preventing liquid penetration into the holder interior while maintaining seal effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents corrosion of electrical contacts by removing the plating solution from the seals, ensuring consistent contact resistance and uniform plating across multiple substrates.
Implementation Method 1
forming a flow of gas passing through a gap between the substrate to be plated and the seal, the flow of gas being directed from an inside to an outside of the substrate holder
Implementation Method 2
forming a flow of gas passing through the gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder
Data Source
AI summary
A method capable of removing a liquid from a seal of a substrate holder so as to prevent contact between the liquid and an electrical contact of the substrate holder is provided. The method includes: immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate; applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate; pulling up the plated substrate from the plating solution; separating the seal from the plated substrate; and forming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder.