Flexible Substrate Peeling via Electrolytic Metal Dissolution

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Solution Overview

Problem

The existing methods for peeling flexible substrates from rigid substrates often cause significant damage, leading to reduced product yield and increased costs in flexible display device manufacturing.

Innovation Solution

A method involving the formation of a multilayered board with a thin-film metal layer, transparent protective layer, and flexible underlay, followed by electrolysis in an electrolytic cell to dissolve the metal layer and peel off the substrate, thereby forming a flexible substrate with a retained protective layer and underlay.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanization, chemical etching, or laser methods are used to peel the flexible substrate from the rigid substrate, then the peeling efficiency is improved and mass production is realized, but the flexible substrate is seriously damaged, reducing product yield and device lifetime

Engineering Contradiction:

Improvepeeling efficiencyVSAvoidflexible substrate integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent replaces mechanical peeling methods with electrochemical dissolution. The thin-film metal layer is dissolved through electrochemical reactions in an electrolyte solution, allowing the flexible substrate to be separated from the rigid substrate without mechanical stress that would cause damage. This substitution of mechanical action with electrochemical action resolves the contradiction between peeling efficiency and substrate integrity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical-chemical parameters of the separation process by using electrochemical dissolution instead of mechanical or thermal methods. By controlling electrochemical parameters such as voltage, current density, and electrolyte composition, the thin-film metal layer is selectively dissolved while the flexible substrate remains intact, achieving both high efficiency and high quality separation.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If conventional peeling methods are used, then mass production is achieved, but manufacturing costs increase due to reduced product yield and shorter device lifetime

Engineering Contradiction:

Improvemass production capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

By replacing costly mechanical peeling equipment and processes with electrochemical dissolution, the patent reduces manufacturing costs. The electrochemical method uses simple electrolyte solutions and power supplies instead of complex mechanical or laser systems, while simultaneously improving product yield by preventing substrate damage during separation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If a thin-film metal layer is used to bond the flexible substrate to the rigid substrate, then the bonding strength is sufficient for component preparation, but the separation process becomes difficult without causing damage

Engineering Contradiction:

Improvebonding strengthVSAvoiddamage during separation

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent changes the chemical state of the thin-film metal layer during separation. The metal layer, which provides strong bonding during manufacturing, is selectively dissolved through electrochemical reactions during separation. This parameter change from solid metal to dissolved ions allows easy separation without damage to the flexible substrate.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent extracts the thin-film metal layer from the multilayer structure through electrochemical dissolution. By selectively removing only the metal bonding layer while leaving the flexible substrate and rigid substrate intact, the method enables clean separation without the need for forceful mechanical detachment that would cause damage.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This process effectively protects components, improving product yield and reducing manufacturing costs by minimizing damage during the peeling process.

Implementation Method 1

electrolyzing the thin-film metal layer, causing the thin-film metal layer to dissolve until the thin-film metal layer disappears, and causing the base to peel off the multilayered board

Methodology Applied

Scientific EffectElectrolysis: Electrolysis

Data Source

PatentUS11450823B2Method of manufacturing flexible substrate

Publication Date: 2022.09.20 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD

AI summary

A method of manufacturing a flexible substrate includes a step of preparing a multilayered board and a step of electrolysis. The step of preparing the multilayered board includes forming a thin-film metal layer on a base; next, forming a transparent protective layer on the thin-film metal layer; and then forming a flexible underlay on the transparent protective layer so that the multilayered board is formed. The step of electrolysis includes providing an electrolytic cell; putting the multilayered board made up of the base, the thin-film metal layer, the transparent protective layer, and the flexible underlay in the electrolytic cell; and electrolyzing the thin-film metal layer, causing the thin-film metal layer to dissolve until the thin-film metal layer disappears, and causing the base to peel off the multilayered board. Lastly, the flexible substrate retaining the transparent protective layer and the flexible underlay is formed.