Electron Multiplier Resistive Layer Removal for Thermal Management
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Solution Overview
Problem
In electron multipliers, the formation of resistive layers on both inner and outer surfaces using atomic layer deposition methods leads to potential differences and Joule heat generation, causing temperature rises during operation.
Innovation Solution
An electron multiplier production method where the resistive layer is formed only on the inner surface of channels and the outer surface is kept resistive layer-free, using atomic layer deposition, and optionally removing the deposition layer from the outer surface, and thermally connecting a metal heat sink to the outer surface to prevent current flow and heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resistive layer is formed on the outer surface of the substrate using the atomic layer deposition method, then the secondary electron emission efficiency is improved, but Joule heat is generated in the resistive layer and the temperature of the entire CEM rises
Solution Approach 1:
The patent extracts the harmful resistive layer from the outer surface of the substrate while preserving it on the inner surface of the channel. This is achieved by forming the resistive layer on the entire substrate surface first, then selectively removing it from the outer surface through etching or other removal processes, thereby eliminating the source of unwanted Joule heat while maintaining the electron multiplication function inside the channel
Solution Approach 2:
The patent applies different properties to different parts of the substrate: the inner surface of the channel retains the resistive layer for secondary electron emission, while the outer surface is made resistive-layer-free to prevent current flow and heat generation. This local differentiation of properties resolves the contradiction between emission efficiency and temperature control
2Ease of manufacture
If the resistive layer is formed on the outer surface of the substrate, then the resistive layer structure is complete, but current flows in the resistive layer on the outer surface causing Joule heat generation
Solution Approach 1:
The harmful current flow and associated energy loss are eliminated by extracting the resistive layer from the outer surface where it would create unwanted current paths. The manufacturing process is simplified by forming the layer uniformly first, then selectively removing it, which is easier than attempting to form it only in specific areas from the start
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses temperature rises in electron multipliers by preventing current flow through the resistive layer on the outer surface, ensuring efficient operation and cooling.
Implementation Method 1
forming at least a resistive layer on an outer surface of the main body member and an inner surface of the communicating hole using an atomic layer deposition method
Implementation Method 2
a potential difference also occurs in the resistive layer formed on the outer surface of the substrate and a current flows in the resistive layer. Therefore, there is concern that Joule heat may be generated in the resistive layer
Implementation Method 3
thermally connecting a heat sink to the outer surface
Data Source
AI summary
An electron multiplier production method including a main body portion, and a channel provided in the main body portion to open at one end surface and the other end surface of the main body portion and emits secondary electrons includes a first step of preparing a main body member including the one end surface and the other end surface, a communicating hole for the channel through which the one end surface and the other end surface communicate being provided in the main body member, a second step of forming the channel by forming a deposition layer including at least a resistive layer on an outer surface of the main body member and an inner surface of the communicating hole using an atomic layer deposition method, and a third step of forming the main body portion by removing the deposition layer formed on the outer surface of the main body member.