Electronic Apparatus Cover with Segmented Sealing Layers
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Solution Overview
Problem
The miniaturization of electronic apparatuses with hermetically sealed functional elements is hindered by the need for thick sealing layers to maintain strength, which prevents the formation of micro release holes and increases the diameter of release holes, making it difficult to achieve a compact design.
Innovation Solution
A two-layer structure for the cover portion, where a first layer with higher rigidity and thickness is combined with a second layer that can be microfabricated to form smaller through holes, reducing the thickness of the sealing layer and allowing for miniaturization while maintaining strength, and the sacrificial layer is removed through these holes using etching techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the cover portion is increased to maintain strength, then the strength of the cover portion is improved, but the diameter of the through hole increases and the sealing layer becomes thick, making miniaturization difficult
Solution Approach 1:
The cover portion is divided into a first cover portion and a second cover portion with different functions. The first cover portion provides mechanical strength while the second cover portion enables microfabrication of small through holes. This segmentation allows each layer to be optimized independently, resolving the contradiction between strength and miniaturization.
Solution Approach 2:
The patent uses a composite structure combining two different materials: a first material for the strength-providing layer and a second material for the microfabrication layer. This composite approach allows the system to simultaneously achieve high strength and small through hole dimensions, enabling miniaturization without compromising structural integrity.
2Volume of moving object
If the diameter of the through hole is reduced for miniaturization, then the size of the electronic apparatus is reduced, but the thickness of the sealing layer must be increased to maintain strength
Solution Approach 1:
The sealing function is segmented between two layers: the first cover portion that provides mechanical strength and the second cover portion that is microfabricated with small through holes. This segmentation allows the sealing layer to be thin while maintaining strength through the composite structure.
Solution Approach 2:
Different regions of the cover portion are assigned different properties: the first cover portion has high mechanical strength properties while the second cover portion has microfabrication-friendly properties. This local differentiation allows small through holes to be formed without requiring a thick sealing layer throughout the entire structure.
3Volume of moving object
If a single-layer cover structure is used, then the device complexity is reduced, but it is not possible to achieve both strength and miniaturization simultaneously
Solution Approach 1:
The cover portion is segmented into two functional layers with distinct roles. The first layer provides mechanical strength while the second layer enables miniaturization through microfabrication. This segmentation resolves the contradiction between device complexity and achieving miniaturization goals.
Solution Approach 2:
The patent employs a composite two-layer structure where each material is selected for its specific properties. This composite approach enables simultaneous achievement of strength and miniaturization, justifying the increased structural complexity by delivering the required performance benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the miniaturization of electronic apparatuses while maintaining the strength of the cover portion, allowing for smaller through holes and reduced sealing layer thickness, which is essential for compact designs and integration of additional components like MOS transistors on the same substrate.
Implementation Method 1
the sacrificial layer is removed through these holes using etching techniques
Data Source
AI summary
An electronic apparatus according to the invention includes a substrate, a side wall that is disposed directly on the substrate or via an insulation film and forms a hollow, a functional element that is disposed within the hollow, a first layer that is disposed on the side wall so as to cover the hollow and has a first through hole that communicates with the hollow, a second layer that is disposed on the first layer so as to cover the hollow and has a second through hole that has a diameter smaller than a diameter of the first through hole and at least partially overlaps the first through hole as viewed in plan view, and a third layer that is disposed on the second layer so as to seal at least the second through hole.