Electronic Assembly Aging Detection Using Electric Field Sensing
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Solution Overview
Problem
Existing methods for predicting the service life of electronic assemblies, particularly power electronic assemblies, are limited by the inability to reliably detect aging phenomena such as delamination and cracks in bond wires and solder layers during operation, which are difficult to visualize using complex imaging techniques.
Innovation Solution
A method involving electric field measurement using field mills or electroscopes, particularly microelectromechanical designs, to detect static and time-varying electric fields emanating from components, allowing for continuous monitoring and direct detection of changes in bond wires and solder layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If imaging techniques such as X-rays, ultrasound microscopy, or thermography are used to visualize aging phenomena, then spatial resolution and detection capability are improved, but device complexity and ease of operation deteriorate
Solution Approach 1:
The patent replaces complex mechanical and optical imaging systems (X-ray, ultrasound, thermography) with an electrical measurement system that uses voltage measurements and equivalent circuit models to detect aging phenomena. This substitution maintains detection capability while dramatically reducing device complexity and enabling continuous monitoring during operation.
Solution Approach 2:
The patent introduces an equivalent circuit model as an intermediary that translates physical aging phenomena (cracks, delaminations) into measurable electrical parameter changes. This model acts as a mediator between the physical defect and the measurement system, simplifying the detection process while maintaining precision.
2Measurement precision
If imaging techniques are used to detect aging phenomena, then measurement precision is improved, but ease of operation during ongoing operation deteriorates
Solution Approach 1:
The patent replaces complex imaging systems with simple voltage measurement circuits that can be easily integrated into the electronic assembly. This substitution enables continuous monitoring during operation without requiring complex equipment or interrupting normal operation, dramatically improving ease of operation.
Solution Approach 2:
The measurement system uses the electronic assembly's own operating voltage and circuit structure to perform self-diagnosis. The existing power supply and circuit elements serve dual purposes: normal operation and aging detection. This self-service approach eliminates the need for separate complex testing equipment during operation.
3Reliability
If accelerated aging tests with discrete point-in-time testing are used, then service life prediction is achieved, but productivity and continuous monitoring capability deteriorate
Solution Approach 1:
The patent transforms discrete point-in-time testing into continuous monitoring by permanently integrating voltage measurement circuits into the electronic assembly. The system continuously measures voltage parameters during normal operation, enabling real-time detection of aging phenomena without interrupting productivity or requiring separate test cycles.
Solution Approach 2:
The patent performs preliminary characterization during manufacturing to establish baseline parameters and equivalent circuit models. This preliminary action enables subsequent continuous monitoring during operation to detect deviations from normal aging patterns, allowing early warning before actual failure occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous, in-situ monitoring of electronic assemblies by directly detecting defects in bond wires and solder layers, providing immediate indications of damage without the need for discrete testing or probability calculations.
Implementation Method 1
an electric field measuring device F1-Fn arranged at a distance from the electronic assembly 10 to be monitored... a static electric field, a time-varying electric field, or both, which emanates from at least one element of the electrical assembly during operation
Data Source
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AI summary
The invention relates to a method for monitoring an electronic assembly, a component arranged with a monitoring device, and an electronic assembly. It is proposed to perform an electric field measurement, in which an electric field (E, E(t)) of at least one component (11) of the electronic assembly (10) is detected and evaluated. Such a measurement directly indicates changes to the assembly (10). Microelectromechanical field mills or electroscopes (F1-Fn) are preferably used for electric field measurement.