Electronic Component Adhesive Layer for Airtight Sealing
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Solution Overview
Problem
Existing electronic components with sealing structures face challenges in achieving high airtightness due to the relatively high air permeability of adhesives, leading to gas leaks and moisture ingress, even when using adhesives with inorganic fillers.
Innovation Solution
An electronic component with a sealing structure that incorporates an adhesive layer containing organic and inorganic fillers, where the inorganic fillers have a minimum particle diameter smaller than the adhesive layer thickness, and are strategically positioned between organic fillers and the component/body, enhancing airtightness by applying pressure during curing to ensure contact and forming a cured thermosetting resin adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive composition containing inorganic fillers is used, then adhesive strength is improved, but airtightness is insufficient
Solution Approach 1:
The patent uses a composite adhesive composition containing both inorganic fillers (such as aluminum oxide, aluminum nitride, or boron nitride with particle diameters of 0.1 to 10 μm) and organic fillers (such as rubber particles with particle diameters of 5 to 50 μm). This composite structure combines the strength-providing inorganic fillers with the airtightness-providing organic fillers, resolving the contradiction between adhesive strength and airtightness.
Solution Approach 2:
The patent applies different fillers with different properties to different locations within the adhesive layer. The inorganic fillers are distributed throughout the adhesive composition to provide overall structural strength, while organic fillers are present to specifically address airtightness requirements. This local differentiation of material properties allows simultaneous optimization of both strength and airtightness.
2Reliability
If adhesive with high airtightness is used, then sealing performance is improved, but adhesive strength may be compromised
Solution Approach 1:
The adhesive composition is designed as a composite system where inorganic fillers (aluminum oxide, aluminum nitride, boron nitride) provide the necessary adhesive strength and structural integrity, while organic fillers (rubber particles) provide the airtightness. The synergistic combination ensures that high airtightness is achieved without compromising adhesive strength.
Solution Approach 2:
The patent specifies precise parameter ranges for the filler components: inorganic fillers with particle diameters of 0.1 to 10 μm and organic fillers with particle diameters of 5 to 50 μm. By controlling these particle size parameters and their proportions, the adhesive achieves optimal balance between strength and airtightness properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the airtightness and reliability of electronic components by preventing gas leaks and moisture ingress, while maintaining adequate adhesive strength within specific filler content ranges.
Implementation Method 1
a sealing member (11), and an adhesive layer (13a, 13b). The sealing member seals the electronic component body (10). The adhesive layer adheres between the electronic component body and the sealing member.
Implementation Method 2
the organic fillers are in contact by pressure with both the electronic component body and the sealing member
Data Source
AI summary
An electronic component that includes an electronic component body, sealing members sealing the electronic component body, and adhesive layers which adhere the electronic component body and the sealing members, respectively. Between the electronic component body and the sealing members, sealed spaces are formed, respectively. The adhesive layers each contain organic fillers and inorganic fillers. The organic fillers are in contact with both the electronic component body and the sealing members. The inorganic fillers each have a minimum particle diameter smaller than the thickness of each of the adhesive layers. When the adhesive layers are viewed in a thickness direction thereof, the inorganic fillers are provided between the organic fillers and the electronic component body and between the organic fillers and each of the sealing members.