Electronic Component with Asymmetric Coil Capacitor Gaps
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Solution Overview
Problem
LC resonance circuits used in high-frequency communication devices face variations in resonant frequency due to the arrangement of coil and capacitor components, leading to instability and performance issues.
Innovation Solution
The electronic component incorporates a configuration with multiple coil and capacitor conductor layers arranged in specific patterns, including parallel and alternating gaps, to minimize variations in characteristics and thermal stress, while forming a parallel LC resonance circuit for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two elements (coil and capacitor) are included in the electronic component, then the resonant frequency can be adjusted, but variations in resonant frequency increase
Solution Approach 1:
The capacitor is divided into multiple capacitor conductor layers (first capacitor conductor layer, second capacitor conductor layer, etc.) arranged in the lamination direction. This segmentation allows for more precise control of capacitance distribution and reduces variations in resonant frequency while maintaining adjustability.
Solution Approach 2:
Different gaps are introduced between the coil conductor layer and capacitor conductor layers at different positions. The first gap between the first coil conductor layer and first capacitor conductor layer differs from the second gap between the second coil conductor layer and second capacitor conductor layer, creating local variations that reduce overall frequency variations.
2Reliability
If multiple capacitor conductor layers are arranged in the lamination direction with different gaps, then variations in characteristics are reduced, but manufacturing complexity increases
Solution Approach 1:
The first capacitor conductor layer and second capacitor conductor layer are merged into a single capacitor structure within the same electronic component body, sharing common electrode patterns and insulating layers. This merging reduces manufacturing complexity while maintaining the beneficial effect of multiple layers with different gaps.
Solution Approach 2:
The capacitor conductor layers are arranged in the lamination direction (vertical dimension) rather than only in the planar direction. This dimensional change allows for compact integration of multiple capacitor elements with different gaps, reducing overall device complexity while achieving characteristic stability.
Data Source
AI summary
An electronic component includes a body having a side surface, coil conductor layers wound along main surfaces parallel to the side surface, and capacitor conductor layers each having a substantially plate-like shape parallel to the side surface. The coil conductor layers and the capacitor conductor layers are arranged in a widthwise direction perpendicular to the side surface. The capacitor conductor layers include first and second capacitor conductor layers adjacent to each other in the widthwise direction. The coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer. The shortest distance between the first coil conductor layer and the first capacitor conductor layer is larger than the shortest distance between the second coil conductor layer and the second capacitor conductor layer.