Impedence Networks TRIZ Cases

Segmented dielectric layers shift spurious responses outside the main band, preventing frequency degradation.

A shield structure for integrated circuits combines a non-metallic portion with a metallic ground strap to inhibit eddy currents.

Integrated organic packaging structures reduce manufacturing costs and improve yields by merging resonator fabrication with enclosure formation.

Parallel conductor lines reduce electrical length, maintaining isolation while preventing insertion loss increases from extended wiring.

Support frames create air-gaps to decouple electrical excitation from acoustic propagation, eliminating spurious modes.

Glass lid body shields electromagnetic interference in crystal controlled oscillators, eliminating metal components to reduce device complexity.

Asymmetric spacing between coil and capacitor conductor layers reduces resonant frequency variations in high-frequency LC circuits.

A piezoelectric device uses a lanthanum-based layered perovskite buffer layer to enhance crystal orientation and electrical conductivity.

An embedded filter package merges SAW and BAW devices into a single substrate structure, reducing assembly complexity while maintaining signal integrity.

A bonded substrate joins quartz and piezoelectric layers via ultraviolet light irradiation under reduced pressure to form a stable covalent interface.

Airtightly sealing cap uses a thin Au-Sn brazing filler metal layer to bond electronic component packages.

Segmented comb electrodes create distinct capacitance values to quantify destruction causes in surface acoustic wave filters.

A support layer with a lower linear thermal expansion coefficient reduces stress on bumps in acoustic wave devices.

Inclined sections in the housing package bury connection conductors to prevent metallization paste spreading during pressure application.

Electrolytic nickel plating on corrosion-resistant metal plates prevents barrel overlap corrosion while maintaining hermetic sealability.

A multilayer helical wave filter integrates into implanted medical leads to create high impedance at resonant frequencies.

A protective layer shields the bottom electrode during planarization to maintain uniform thickness.

A transmit filter circuit uses series and parallel arm resonators with distinct resonant frequencies to attenuate interference waves.

Internal conductors with expanded portions reinforce the sealed space around the piezoelectric element, preventing collapse during high-pressure resin molding.

A vibrator device uses shifted crystal axes in the relay substrate to separate mechanical resonance frequencies from the piezoelectric element.

Segmented bump structures reduce thermal stress on connection bumps between bonded acoustic wave substrates, preventing peeling or rupture.

A curved cover seals an elastic wave element on a thin mounting substrate to maintain resin parallelism.

A packaged RF front end integrates a hybrid filter and active circuits using a seal ring to hermetically enclose an acoustic wave resonator.

Gratings with modified finger duty ratio and pitch confine acoustic energy within the interdigital transducer aperture.

A conductive layer on the protective cover prevents structural deformation during resin sealing.

An electrically conductive holding member containing a gradient of insulating filler reduces vibration impedance while maintaining bonding strength.

Vertical bump connections reduce parasitic effects in stacked resonators, enabling compact high-precision clock signal generation.

Relocating cavities to the quartz surface preserves electrical connection area while homogenous layers reduce thermal stress.

Assigning distinct tilt angles to serial and parallel arm resonators reduces transverse mode ripples while maintaining steepness of filter characteristics.

A piezoelectric vibrator design with reverse-polarized layers and segmented electrodes.

An asymmetric terminal arrangement eliminates parasite capacitance, reducing insertion loss and VSWR while improving amplitude balance.

A crystal oscillating element uses a thinner outer peripheral portion around the central mesa to reduce mechanical stress on the substrate.

Micro-transfer printing a piezoelectric filter element onto a semiconductor substrate reduces device volume while maintaining filtering performance.

A waveguide driving circuit uses a choke and switch to generate high-intensity current pulses with steep edges from a low-voltage source.

A longitudinally-coupled-resonator acoustic wave filter device uses parallel resonators with differing electrostatic capacitance to reduce insertion loss.

A bulk acoustic wave resonator uses a quadratic surface scaffold to conformally deposit electrodes and piezoelectric layers.

Radial vibration portions with optimized aspect ratios minimize thermoelastic loss and vibration leakage, boosting the Q value.

Sloping side faces on crystal element protrusions reduce oscillation reflection, lowering equivalent series resistance and improving electric characteristics.

A heat-curable sealing body with tuned expansion coefficients protects the piezoelectric substrate.

Segmented insulating films with high moisture resistance inhibit water penetration through apertures, preventing corrosion of the piezoelectric substrate.

Applying Au/Sn alloy to the ceramic plate main surface enables precise cap bonding and reduces frequency variations.

Surrounding support layer prevents piezoelectric separation during dicing, maintaining device integrity and acoustic performance.

A multi-carrier transmitter combines baseband signals into a composite signal for single-path modulation.

Pixel-based projected electrodes suppress spurious modes and minimize acceleration sensitivity in quartz resonators by dynamically tuning individual pixels.

Varying dielectric film thickness in gap portions disperses sound velocities to suppress high-order transverse mode spurious responses.

A radio frequency microelectromechanical resonator uses p-n junction electrostatic forces to generate mechanical motion and sense displacement.

High resistivity protective layer shields outermost electrodes from plasma, maintaining electrical stability.

A semiconductor package integrates passive inductors over the die using a conductive bridge and fan-out redistribution layer for precise electrical connection.