Organic Back End Packaging for FBAR Resonators
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Solution Overview
Problem
Current packaging solutions for Bulk Acoustic Wave (BAW) resonators and filters are costly and have low yields, particularly in the late stages of manufacturing, which is detrimental due to the complexity and cost associated with fabricating and segmenting arrays of packaged components.
Innovation Solution
A method for fabricating packaged components involving stages such as obtaining an active membrane layer, depositing electrodes, patterning, and selectively applying passivation layers, followed by creating cavities and routing structures to form a packaged FBAR resonator with an organic back end, enabling efficient packaging and integration of resonators into RF filters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging solutions are used for BAW resonators, then the resonators can be packaged, but the packaging cost increases and manufacturing yield decreases
Solution Approach 1:
The patent merges the resonator fabrication process with the packaging process by forming both on the same carrier substrate simultaneously. The packaging structure (enclosure, cavities, through-vias) is created as an integrated part of the resonator array fabrication, eliminating the need for separate packaging operations and reducing both cost and yield loss.
Solution Approach 2:
The packaging structure is prepared in advance during the resonator fabrication process itself. The carrier substrate is patterned with enclosure regions, cavities, and through-vias before the resonators are fully assembled, so that packaging is already in place when resonators are transferred and sealed, preventing yield loss in late-stage operations.
2Ease of operation
If arrays of packaged components are fabricated and segmented in late stages, then individual packaged components are obtained, but the complexity and cost increase significantly
Solution Approach 1:
The patent creates defined separation regions between resonator arrays on the carrier substrate that allow for clean mechanical or laser cutting into individual packaged components. These segmentation features are built in during the same fabrication process, enabling easy separation without complex post-processing operations.
Solution Approach 2:
The segmentation structure is merged with the packaging structure itself. The same carrier substrate that holds and packages the resonators also contains the separation features, combining multiple functions (packaging, support, and segmentation guidance) into a single integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the packaging efficiency and reduces costs by improving yields and enabling the production of high-performance RF filters with improved Q factors and bandwidth, suitable for next-generation mobile devices.
Implementation Method 1
depositing an inner organic layer comprising an array of back cavities therethrough... selectively depositing an outer organic layer onto the inner organic layer
Data Source
AI summary
A packaged electronic component comprising: an electronic component housed within a package comprising a front part of a package comprising an inner section with a front cavity therein opposite the electronic component defined by the raised frame and an outer section sealing said cavity; and a back part of the package comprising a back cavity in an inner back section, and an outer back section sealing the cavity, said back package further comprising a first and a second via through the back end around said at least one back cavity for coupling to front and back electrodes of the electronic component; the vias terminating in external contact pads adapted to couple the package in a flip chip configuration to a circuit board.