Electronic Component Device Spacing via Non-Opposed Wiring
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Solution Overview
Problem
The challenge is to ensure sufficient spacing between a semiconductor chip and an upper wiring substrate in electronic component devices, where reducing the diameter of conductive balls to narrow the pitch leads to difficulties in filling the space with sealing resin, and increasing ball diameter risks short-circuiting and reduced manufacturing yield.
Innovation Solution
The electronic component device features a lower wiring substrate with an electronic component, an upper wiring substrate, bump conductors for electrical connection, and a sealing resin, where the upper substrate includes a first wiring layer exposed through an opening in a first insulating layer, ensuring this layer is not opposed to the component in the thickness direction, allowing for adequate spacing even with narrowed pitch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the diameter of conductive balls is reduced to narrow the pitch, then the connection pitch between wiring substrates is improved, but the gap between semiconductor chip and upper wiring substrate is narrowed making it difficult to fill with sealing resin
Solution Approach 1:
The patent shifts the solution from the horizontal dimension (conductive ball diameter) to the vertical dimension (upper wiring substrate structure). By making the first wiring layer and first insulating layer non-opposed to the electronic component in the thickness direction, the patent creates vertical spacing that enables sealing resin filling without changing the horizontal pitch of conductive balls.
2Reliability
If the diameter of conductive balls is increased to maintain gap spacing, then the sealing resin filling is improved, but short-circuiting risk increases and manufacturing yield decreases
Solution Approach 1:
The patent segments the upper wiring substrate into distinct functional layers: a first wiring layer for electrical connection to bump conductors, and a first insulating layer for isolation. This segmentation allows the wiring structure to be positioned away from the electronic component, creating space for sealing resin without requiring larger conductive balls.
3Volume of moving object
If the thickness of semiconductor chip is reduced to narrow pitch, then the overall device size is reduced, but the gap for sealing resin filling is further narrowed
Solution Approach 1:
The patent introduces an intermediary structure (the combination of first wiring layer and first insulating layer positioned non-opposed to the electronic component) that mediates between the upper wiring substrate and the electronic component. This intermediary creates the necessary spacing for sealing resin filling while allowing the semiconductor chip to maintain its optimized thickness.
Data Source
AI summary
An electronic component device includes: a lower wiring substrate; an electronic component on the lower wiring substrate; an upper wiring substrate disposed above the lower wiring substrate and the electronic component; a bump conductor disposed between the lower wiring substrate and the upper wiring substrate to electrically connect the lower wiring substrate and the upper wiring substrate; and a sealing resin provided between the lower wiring substrate and the upper wiring substrate to seal the electronic component and the bump conductor. The upper wiring substrate includes: a first wiring layer directly connected to the bump conductor; and a first insulating layer having an opening portion through which the first wiring layer is exposed and disposed to cover the first wiring layer. The first wiring layer and the first insulating layer are not opposed to the electronic component in a thickness direction of the electronic component device.